Advanced surface finishing technology for electronics application

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Extensively used in electronics application are electroplating and electroless-plating methods. The printed wiring boards (PWB), in order to raise the packing density, uses both techniques to employ higher multi-layer and higher surface density. Described in the paper is advanced surface finishing in electronics application. Plating technique has become an important key technology in this field. Its increased usage and applications are seen to take place in the future.

Original languageEnglish
Title of host publicationProceedings of the AESF Annual Technical Conference
Editors Anon
Place of PublicationOrlando, FL, United States
PublisherPubl by American Electroplaters & Surface Finishers Soc Inc
Pages421-424
Number of pages4
Publication statusPublished - 1993
EventProceedings of the 80th AESF Annual Technical Conference - Anaheim, CA, USA
Duration: 1993 Jun 211993 Jun 24

Other

OtherProceedings of the 80th AESF Annual Technical Conference
CityAnaheim, CA, USA
Period93/6/2193/6/24

Fingerprint

Electronic equipment
Electroless plating
Electroplating
Plating
Printed circuit boards

ASJC Scopus subject areas

  • Mechanical Engineering
  • Metals and Alloys

Cite this

Osaka, T. (1993). Advanced surface finishing technology for electronics application. In Anon (Ed.), Proceedings of the AESF Annual Technical Conference (pp. 421-424). Orlando, FL, United States: Publ by American Electroplaters & Surface Finishers Soc Inc.

Advanced surface finishing technology for electronics application. / Osaka, Tetsuya.

Proceedings of the AESF Annual Technical Conference. ed. / Anon. Orlando, FL, United States : Publ by American Electroplaters & Surface Finishers Soc Inc, 1993. p. 421-424.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Osaka, T 1993, Advanced surface finishing technology for electronics application. in Anon (ed.), Proceedings of the AESF Annual Technical Conference. Publ by American Electroplaters & Surface Finishers Soc Inc, Orlando, FL, United States, pp. 421-424, Proceedings of the 80th AESF Annual Technical Conference, Anaheim, CA, USA, 93/6/21.
Osaka T. Advanced surface finishing technology for electronics application. In Anon, editor, Proceedings of the AESF Annual Technical Conference. Orlando, FL, United States: Publ by American Electroplaters & Surface Finishers Soc Inc. 1993. p. 421-424
Osaka, Tetsuya. / Advanced surface finishing technology for electronics application. Proceedings of the AESF Annual Technical Conference. editor / Anon. Orlando, FL, United States : Publ by American Electroplaters & Surface Finishers Soc Inc, 1993. pp. 421-424
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