Advanced surface finishing technology for electronics application

Research output: Contribution to conferencePaper

Abstract

Extensively used in electronics application are electroplating and electroless-plating methods. The printed wiring boards (PWB), in order to raise the packing density, uses both techniques to employ higher multi-layer and higher surface density. Described in the paper is advanced surface finishing in electronics application. Plating technique has become an important key technology in this field. Its increased usage and applications are seen to take place in the future.

Original languageEnglish
Pages421-424
Number of pages4
Publication statusPublished - 1993 Dec 1
EventProceedings of the 80th AESF Annual Technical Conference - Anaheim, CA, USA
Duration: 1993 Jun 211993 Jun 24

Other

OtherProceedings of the 80th AESF Annual Technical Conference
CityAnaheim, CA, USA
Period93/6/2193/6/24

ASJC Scopus subject areas

  • Mechanical Engineering
  • Metals and Alloys

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  • Cite this

    Osaka, T. (1993). Advanced surface finishing technology for electronics application. 421-424. Paper presented at Proceedings of the 80th AESF Annual Technical Conference, Anaheim, CA, USA, .