Advancement of analysis method for electromagnetic screening effect of viaducts for railway

Tamio Okutani, Nobuyuki Nakamura, Natsuki Terada, Yutaka Tate, Satoshi Inada, Tomoyuki Ogawa, Yoshio Son, Shinji Wakao

    Research output: Contribution to journalArticle

    3 Citations (Scopus)

    Abstract

    New method to estimate electromagnetic screening effect of rigid frame viaducts has been developed. Mutual relationship among the effects of electrical connecting manner of girding bridges; conductivity of the ground; and harmonic frequency was identified theoretically and numerically based on the results of multiple conductor circuit model simulations and field measurements using over 3km length test cables set on a viaduct section of Shinkansen line under construction. Adding, developed modeling method to simplify the equivalent circuit of vast amount of steel bars in the reinforced concrete accelerates the estimation process with enough accuracy. As the result, it became easy to calculate the induced voltage in the cables or in the track circuits with enough accuracy.

    Original languageEnglish
    JournalIEEJ Transactions on Industry Applications
    Volume128
    Issue number3
    DOIs
    Publication statusPublished - 2008

    Fingerprint

    Screening
    Cables
    Networks (circuits)
    Equivalent circuits
    Reinforced concrete
    Steel
    Electric potential

    Keywords

    • Electromagnetic interference
    • Multiple conductor circuit
    • Railway
    • Screening effect
    • Viaduct

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering
    • Industrial and Manufacturing Engineering

    Cite this

    Advancement of analysis method for electromagnetic screening effect of viaducts for railway. / Okutani, Tamio; Nakamura, Nobuyuki; Terada, Natsuki; Tate, Yutaka; Inada, Satoshi; Ogawa, Tomoyuki; Son, Yoshio; Wakao, Shinji.

    In: IEEJ Transactions on Industry Applications, Vol. 128, No. 3, 2008.

    Research output: Contribution to journalArticle

    Okutani, Tamio ; Nakamura, Nobuyuki ; Terada, Natsuki ; Tate, Yutaka ; Inada, Satoshi ; Ogawa, Tomoyuki ; Son, Yoshio ; Wakao, Shinji. / Advancement of analysis method for electromagnetic screening effect of viaducts for railway. In: IEEJ Transactions on Industry Applications. 2008 ; Vol. 128, No. 3.
    @article{d4221ff9e47740468d8692ebc4a38475,
    title = "Advancement of analysis method for electromagnetic screening effect of viaducts for railway",
    abstract = "New method to estimate electromagnetic screening effect of rigid frame viaducts has been developed. Mutual relationship among the effects of electrical connecting manner of girding bridges; conductivity of the ground; and harmonic frequency was identified theoretically and numerically based on the results of multiple conductor circuit model simulations and field measurements using over 3km length test cables set on a viaduct section of Shinkansen line under construction. Adding, developed modeling method to simplify the equivalent circuit of vast amount of steel bars in the reinforced concrete accelerates the estimation process with enough accuracy. As the result, it became easy to calculate the induced voltage in the cables or in the track circuits with enough accuracy.",
    keywords = "Electromagnetic interference, Multiple conductor circuit, Railway, Screening effect, Viaduct",
    author = "Tamio Okutani and Nobuyuki Nakamura and Natsuki Terada and Yutaka Tate and Satoshi Inada and Tomoyuki Ogawa and Yoshio Son and Shinji Wakao",
    year = "2008",
    doi = "10.1541/ieejias.128.310",
    language = "English",
    volume = "128",
    journal = "IEEJ Transactions on Industry Applications",
    issn = "0913-6339",
    publisher = "The Institute of Electrical Engineers of Japan",
    number = "3",

    }

    TY - JOUR

    T1 - Advancement of analysis method for electromagnetic screening effect of viaducts for railway

    AU - Okutani, Tamio

    AU - Nakamura, Nobuyuki

    AU - Terada, Natsuki

    AU - Tate, Yutaka

    AU - Inada, Satoshi

    AU - Ogawa, Tomoyuki

    AU - Son, Yoshio

    AU - Wakao, Shinji

    PY - 2008

    Y1 - 2008

    N2 - New method to estimate electromagnetic screening effect of rigid frame viaducts has been developed. Mutual relationship among the effects of electrical connecting manner of girding bridges; conductivity of the ground; and harmonic frequency was identified theoretically and numerically based on the results of multiple conductor circuit model simulations and field measurements using over 3km length test cables set on a viaduct section of Shinkansen line under construction. Adding, developed modeling method to simplify the equivalent circuit of vast amount of steel bars in the reinforced concrete accelerates the estimation process with enough accuracy. As the result, it became easy to calculate the induced voltage in the cables or in the track circuits with enough accuracy.

    AB - New method to estimate electromagnetic screening effect of rigid frame viaducts has been developed. Mutual relationship among the effects of electrical connecting manner of girding bridges; conductivity of the ground; and harmonic frequency was identified theoretically and numerically based on the results of multiple conductor circuit model simulations and field measurements using over 3km length test cables set on a viaduct section of Shinkansen line under construction. Adding, developed modeling method to simplify the equivalent circuit of vast amount of steel bars in the reinforced concrete accelerates the estimation process with enough accuracy. As the result, it became easy to calculate the induced voltage in the cables or in the track circuits with enough accuracy.

    KW - Electromagnetic interference

    KW - Multiple conductor circuit

    KW - Railway

    KW - Screening effect

    KW - Viaduct

    UR - http://www.scopus.com/inward/record.url?scp=72549113973&partnerID=8YFLogxK

    UR - http://www.scopus.com/inward/citedby.url?scp=72549113973&partnerID=8YFLogxK

    U2 - 10.1541/ieejias.128.310

    DO - 10.1541/ieejias.128.310

    M3 - Article

    VL - 128

    JO - IEEJ Transactions on Industry Applications

    JF - IEEJ Transactions on Industry Applications

    SN - 0913-6339

    IS - 3

    ER -