An application of micro-ball wafer bumping to double ball bump for flip chip interconnection

Kohei Tatsumi, Yukihiro Yamamoto, Keiji Iwata, Eiji Hashino, Shinji Ishikawa, Taro Kohno, Fumio Miyajima, Hideaki Nakazawa

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Abstract

Micro-ball wafer bumping method was applied to forming double ball bumps, which increased the bump height to improve the reliability of the flip chip interconnection. The micro solder balls of 100um in diameter were transferred and connected to the whole electrode-pads covered with UBMs(Under Bump Metals) of an 8 inch wafer in one stroke using a fully automated micro ball mounter, which was originally developed. The balls were held on fluxed pads and melted in a reflow furnace. After cleaning the flux residue, the wafer bumped with micro-balls was then encapsulated with epoxy resin containing silica fillers by using Apic Yamada's wafer level molding system. The molding resin was spread to the whole wafer by compressing with a heated flat plate, where the top of the solder bumps were covered with an elastic parting film. The supplied resin volume was previously adjusted to the desired molding thickness. The exposed top of the ball bumps was cleaned and then second micro-ball bumping was processed on the top of the first bumps. The first and second balls were connected by reflowing to form the double ball bumps. The height variation and shear strength of double ball bumps were evaluated. To compare the reliability for the different type of bumps the TCTs and FEM analysis were performed for the chips connected with PCBs.

Original languageEnglish
Title of host publicationProceedings - Electronic Components and Technology Conference
Pages855-860
Number of pages6
Volume1
Publication statusPublished - 2005
Externally publishedYes
Event55th Electronic Components and Technology Conference, ECTC - Lake Buena Vista, FL, United States
Duration: 2005 May 312005 Jun 4

Other

Other55th Electronic Components and Technology Conference, ECTC
CountryUnited States
CityLake Buena Vista, FL
Period05/5/3105/6/4

Fingerprint

Molding
Soldering alloys
Resins
Polychlorinated biphenyls
Epoxy resins
Shear strength
Fillers
Cleaning
Furnaces
Silica
Fluxes
Finite element method
Electrodes
Metals

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Tatsumi, K., Yamamoto, Y., Iwata, K., Hashino, E., Ishikawa, S., Kohno, T., ... Nakazawa, H. (2005). An application of micro-ball wafer bumping to double ball bump for flip chip interconnection. In Proceedings - Electronic Components and Technology Conference (Vol. 1, pp. 855-860)

An application of micro-ball wafer bumping to double ball bump for flip chip interconnection. / Tatsumi, Kohei; Yamamoto, Yukihiro; Iwata, Keiji; Hashino, Eiji; Ishikawa, Shinji; Kohno, Taro; Miyajima, Fumio; Nakazawa, Hideaki.

Proceedings - Electronic Components and Technology Conference. Vol. 1 2005. p. 855-860.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Tatsumi, K, Yamamoto, Y, Iwata, K, Hashino, E, Ishikawa, S, Kohno, T, Miyajima, F & Nakazawa, H 2005, An application of micro-ball wafer bumping to double ball bump for flip chip interconnection. in Proceedings - Electronic Components and Technology Conference. vol. 1, pp. 855-860, 55th Electronic Components and Technology Conference, ECTC, Lake Buena Vista, FL, United States, 05/5/31.
Tatsumi K, Yamamoto Y, Iwata K, Hashino E, Ishikawa S, Kohno T et al. An application of micro-ball wafer bumping to double ball bump for flip chip interconnection. In Proceedings - Electronic Components and Technology Conference. Vol. 1. 2005. p. 855-860
Tatsumi, Kohei ; Yamamoto, Yukihiro ; Iwata, Keiji ; Hashino, Eiji ; Ishikawa, Shinji ; Kohno, Taro ; Miyajima, Fumio ; Nakazawa, Hideaki. / An application of micro-ball wafer bumping to double ball bump for flip chip interconnection. Proceedings - Electronic Components and Technology Conference. Vol. 1 2005. pp. 855-860
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