An efficient algorithm for 3D-IC TSV assignment

Cong Hao; Nan Ding; Takeshi Yoshimura

doi:10.1109/NEWCAS.2016.7604740

An efficient algorithm for 3D-IC TSV assignment

Cong Hao, Nan Ding, Takeshi Yoshimura

Graduate School of Information, Production and Systems

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

4 Citations (Scopus)

Abstract

In this work we solve the 3D-IC TSV assignment which is formulated as an Integer Minimum Cost Multi Commodity (IMCMC) problem. We propose a multi-level algorithm including graph coarsening and un-coarsening, to greatly reduce the IMCMC problem size; benefiting from it, we transform the IMCMC problem into a mixed single and multi commodity problem and partially solved it using min-cost flow method. Further, we extend the layer by layer method for TSV assignment optimization. The experimental results shows that the our proposal generates initial solutions with 2.8% wire length reduction compared to the existing work, and our extended layer by layer method achieves another 1.7% improvement with slight time overhead.

Original language	English
Title of host publication	14th IEEE International NEWCAS Conference, NEWCAS 2016
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781467389006
DOIs	https://doi.org/10.1109/NEWCAS.2016.7604740
Publication status	Published - 2016 Oct 20
Event	14th IEEE International NEWCAS Conference, NEWCAS 2016 - Vancouver, Canada Duration: 2016 Jun 26 → 2016 Jun 29

Other

Other	14th IEEE International NEWCAS Conference, NEWCAS 2016
Country/Territory	Canada
City	Vancouver
Period	16/6/26 → 16/6/29

Keywords

3D-IC
Physical Design
TSV Assignment

ASJC Scopus subject areas

Computer Networks and Communications
Electrical and Electronic Engineering

Access to Document

10.1109/NEWCAS.2016.7604740

Cite this

@inproceedings{75e74f4d1a6847ddb0e9679474088ef0,

title = "An efficient algorithm for 3D-IC TSV assignment",

abstract = "In this work we solve the 3D-IC TSV assignment which is formulated as an Integer Minimum Cost Multi Commodity (IMCMC) problem. We propose a multi-level algorithm including graph coarsening and un-coarsening, to greatly reduce the IMCMC problem size; benefiting from it, we transform the IMCMC problem into a mixed single and multi commodity problem and partially solved it using min-cost flow method. Further, we extend the layer by layer method for TSV assignment optimization. The experimental results shows that the our proposal generates initial solutions with 2.8% wire length reduction compared to the existing work, and our extended layer by layer method achieves another 1.7% improvement with slight time overhead.",

keywords = "3D-IC, Physical Design, TSV Assignment",

author = "Cong Hao and Nan Ding and Takeshi Yoshimura",

year = "2016",

month = oct,

day = "20",

doi = "10.1109/NEWCAS.2016.7604740",

language = "English",

booktitle = "14th IEEE International NEWCAS Conference, NEWCAS 2016",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

address = "United States",

note = "14th IEEE International NEWCAS Conference, NEWCAS 2016 ; Conference date: 26-06-2016 Through 29-06-2016",

}

TY - GEN

T1 - An efficient algorithm for 3D-IC TSV assignment

AU - Hao, Cong

AU - Ding, Nan

AU - Yoshimura, Takeshi

PY - 2016/10/20

Y1 - 2016/10/20

N2 - In this work we solve the 3D-IC TSV assignment which is formulated as an Integer Minimum Cost Multi Commodity (IMCMC) problem. We propose a multi-level algorithm including graph coarsening and un-coarsening, to greatly reduce the IMCMC problem size; benefiting from it, we transform the IMCMC problem into a mixed single and multi commodity problem and partially solved it using min-cost flow method. Further, we extend the layer by layer method for TSV assignment optimization. The experimental results shows that the our proposal generates initial solutions with 2.8% wire length reduction compared to the existing work, and our extended layer by layer method achieves another 1.7% improvement with slight time overhead.

AB - In this work we solve the 3D-IC TSV assignment which is formulated as an Integer Minimum Cost Multi Commodity (IMCMC) problem. We propose a multi-level algorithm including graph coarsening and un-coarsening, to greatly reduce the IMCMC problem size; benefiting from it, we transform the IMCMC problem into a mixed single and multi commodity problem and partially solved it using min-cost flow method. Further, we extend the layer by layer method for TSV assignment optimization. The experimental results shows that the our proposal generates initial solutions with 2.8% wire length reduction compared to the existing work, and our extended layer by layer method achieves another 1.7% improvement with slight time overhead.

KW - 3D-IC

KW - Physical Design

KW - TSV Assignment

UR - http://www.scopus.com/inward/record.url?scp=84999028706&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84999028706&partnerID=8YFLogxK

U2 - 10.1109/NEWCAS.2016.7604740

DO - 10.1109/NEWCAS.2016.7604740

M3 - Conference contribution

AN - SCOPUS:84999028706

BT - 14th IEEE International NEWCAS Conference, NEWCAS 2016

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 14th IEEE International NEWCAS Conference, NEWCAS 2016

Y2 - 26 June 2016 through 29 June 2016

ER -

An efficient algorithm for 3D-IC TSV assignment

Abstract

Other

Keywords

ASJC Scopus subject areas

Access to Document

Other files and links

Fingerprint

Cite this