An efficient algorithm for 3D-IC TSV assignment

Cong Hao, Nan Ding, Takeshi Yoshimura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)


In this work we solve the 3D-IC TSV assignment which is formulated as an Integer Minimum Cost Multi Commodity (IMCMC) problem. We propose a multi-level algorithm including graph coarsening and un-coarsening, to greatly reduce the IMCMC problem size; benefiting from it, we transform the IMCMC problem into a mixed single and multi commodity problem and partially solved it using min-cost flow method. Further, we extend the layer by layer method for TSV assignment optimization. The experimental results shows that the our proposal generates initial solutions with 2.8% wire length reduction compared to the existing work, and our extended layer by layer method achieves another 1.7% improvement with slight time overhead.

Original languageEnglish
Title of host publication14th IEEE International NEWCAS Conference, NEWCAS 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781467389006
Publication statusPublished - 2016 Oct 20
Event14th IEEE International NEWCAS Conference, NEWCAS 2016 - Vancouver, Canada
Duration: 2016 Jun 262016 Jun 29


Other14th IEEE International NEWCAS Conference, NEWCAS 2016


  • 3D-IC
  • Physical Design
  • TSV Assignment

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Electrical and Electronic Engineering


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