Abstract
In this work we solve the 3D-IC TSV assignment which is formulated as an Integer Minimum Cost Multi Commodity (IMCMC) problem. We propose a multi-level algorithm including graph coarsening and un-coarsening, to greatly reduce the IMCMC problem size; benefiting from it, we transform the IMCMC problem into a mixed single and multi commodity problem and partially solved it using min-cost flow method. Further, we extend the layer by layer method for TSV assignment optimization. The experimental results shows that the our proposal generates initial solutions with 2.8% wire length reduction compared to the existing work, and our extended layer by layer method achieves another 1.7% improvement with slight time overhead.
| Original language | English |
|---|---|
| Title of host publication | 14th IEEE International NEWCAS Conference, NEWCAS 2016 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| ISBN (Electronic) | 9781467389006 |
| DOIs | |
| Publication status | Published - 2016 Oct 20 |
| Event | 14th IEEE International NEWCAS Conference, NEWCAS 2016 - Vancouver, Canada Duration: 2016 Jun 26 → 2016 Jun 29 |
Other
| Other | 14th IEEE International NEWCAS Conference, NEWCAS 2016 |
|---|---|
| Country | Canada |
| City | Vancouver |
| Period | 16/6/26 → 16/6/29 |
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Keywords
- 3D-IC
- Physical Design
- TSV Assignment
ASJC Scopus subject areas
- Computer Networks and Communications
- Electrical and Electronic Engineering
Cite this
An efficient algorithm for 3D-IC TSV assignment. / Hao, Cong; Ding, Nan; Yoshimura, Takeshi.
14th IEEE International NEWCAS Conference, NEWCAS 2016. Institute of Electrical and Electronics Engineers Inc., 2016. 7604740.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - An efficient algorithm for 3D-IC TSV assignment
AU - Hao, Cong
AU - Ding, Nan
AU - Yoshimura, Takeshi
PY - 2016/10/20
Y1 - 2016/10/20
N2 - In this work we solve the 3D-IC TSV assignment which is formulated as an Integer Minimum Cost Multi Commodity (IMCMC) problem. We propose a multi-level algorithm including graph coarsening and un-coarsening, to greatly reduce the IMCMC problem size; benefiting from it, we transform the IMCMC problem into a mixed single and multi commodity problem and partially solved it using min-cost flow method. Further, we extend the layer by layer method for TSV assignment optimization. The experimental results shows that the our proposal generates initial solutions with 2.8% wire length reduction compared to the existing work, and our extended layer by layer method achieves another 1.7% improvement with slight time overhead.
AB - In this work we solve the 3D-IC TSV assignment which is formulated as an Integer Minimum Cost Multi Commodity (IMCMC) problem. We propose a multi-level algorithm including graph coarsening and un-coarsening, to greatly reduce the IMCMC problem size; benefiting from it, we transform the IMCMC problem into a mixed single and multi commodity problem and partially solved it using min-cost flow method. Further, we extend the layer by layer method for TSV assignment optimization. The experimental results shows that the our proposal generates initial solutions with 2.8% wire length reduction compared to the existing work, and our extended layer by layer method achieves another 1.7% improvement with slight time overhead.
KW - 3D-IC
KW - Physical Design
KW - TSV Assignment
UR - http://www.scopus.com/inward/record.url?scp=84999028706&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84999028706&partnerID=8YFLogxK
U2 - 10.1109/NEWCAS.2016.7604740
DO - 10.1109/NEWCAS.2016.7604740
M3 - Conference contribution
AN - SCOPUS:84999028706
BT - 14th IEEE International NEWCAS Conference, NEWCAS 2016
PB - Institute of Electrical and Electronics Engineers Inc.
ER -