Abstract
In this work we solve the 3D-IC TSV assignment which is formulated as an Integer Minimum Cost Multi Commodity (IMCMC) problem. We propose a multi-level algorithm including graph coarsening and un-coarsening, to greatly reduce the IMCMC problem size; benefiting from it, we transform the IMCMC problem into a mixed single and multi commodity problem and partially solved it using min-cost flow method. Further, we extend the layer by layer method for TSV assignment optimization. The experimental results shows that the our proposal generates initial solutions with 2.8% wire length reduction compared to the existing work, and our extended layer by layer method achieves another 1.7% improvement with slight time overhead.
Original language | English |
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Title of host publication | 14th IEEE International NEWCAS Conference, NEWCAS 2016 |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
ISBN (Electronic) | 9781467389006 |
DOIs | |
Publication status | Published - 2016 Oct 20 |
Event | 14th IEEE International NEWCAS Conference, NEWCAS 2016 - Vancouver, Canada Duration: 2016 Jun 26 → 2016 Jun 29 |
Other
Other | 14th IEEE International NEWCAS Conference, NEWCAS 2016 |
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Country/Territory | Canada |
City | Vancouver |
Period | 16/6/26 → 16/6/29 |
Keywords
- 3D-IC
- Physical Design
- TSV Assignment
ASJC Scopus subject areas
- Computer Networks and Communications
- Electrical and Electronic Engineering