An electrochemical investigation of additive effect in trench-filling of ULSI interconnects by electroless copper deposition

Madoka Hasegawa*, Noriyuki Yamachika, Yutaka Okinaka, Yosi Shacham-Diamand, Tetsuya Osaka

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

14 Citations (Scopus)

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Engineering & Materials Science

Chemical Compounds