An Embedded SiC Module with Using NMPB Interconnection for Chevron Shaped Cu Lead and Electrodes

Naoki Fukui, Keiko Koshiba, Itaru Miyazaki, Isamu Morisako, Tomonori Iizuka, Tomoya Itose, Masayuki Hikita, Rikiya Kamimura, Kohei Tatsumi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Chemical Compounds

Engineering & Materials Science