An Origami-Structured Flexible Electronic Substrate with Faces Parallel to Target-of-Attachment Surfaces

Hiroki Yasuga, Atsushi Eda, Kai Suto, Tomohiro Tachi, Eiji Iwase

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We propose a flexible electronic substrate structured by Origami folding of non-stretchable film with faces parallel to target-of-attachment surfaces. A folding ('Origami') or cutting ('Kirigami') of a thin film have opened up the application of non-stretchable materials to flexible electronic devices attached to a curved surface. In this paper, we propose origami-structured flexible electronic substrates which have faces parallel to the target-of-attachment surface. The parallel faces have engineering importance and usefulness for taking direct contact with target-of-attachment surfaces and mounting electronic elements, e.g. sensors or light emitters. These characteristics are expected to allow for the realization of flexible devices capable of sensing shear force or flow velocity parallel to object's surfaces.

Original languageEnglish
Title of host publication33rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2020
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages909-912
Number of pages4
ISBN (Electronic)9781728135809
DOIs
Publication statusPublished - 2020 Jan
Event33rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2020 - Vancouver, Canada
Duration: 2020 Jan 182020 Jan 22

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
Volume2020-January
ISSN (Print)1084-6999

Conference

Conference33rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2020
CountryCanada
CityVancouver
Period20/1/1820/1/22

Keywords

  • Extruded Miura-Ori
  • Flexible electronic devices
  • Origami
  • Self-folding

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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  • Cite this

    Yasuga, H., Eda, A., Suto, K., Tachi, T., & Iwase, E. (2020). An Origami-Structured Flexible Electronic Substrate with Faces Parallel to Target-of-Attachment Surfaces. In 33rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2020 (pp. 909-912). [9056110] (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); Vol. 2020-January). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MEMS46641.2020.9056110