Analyses of transient behaviors of no-insulation REBCO pancake coils during sudden discharging and overcurrent

Tao Wang, So Noguchi, Xudong Wang, Issei Arakawa, Katsuhiko Minami, Katsutoshi Monma, Atsushi Ishiyama, Seungyong Hahn, Yukikazu Iwasa

    Research output: Contribution to journalArticle

    58 Citations (Scopus)

    Abstract

    Stability margin of a high-temperature superconducting (HTS) coil is two or three orders of magnitude greater than that of a low-temperature superconducting coil. In recent years, many papers have reported test results of turn-to-turn no-insulation (NI) HTS coils having extremely enhanced thermal stability, such that burnout never occurs in an NI coil, even at an operating current exceeding 2.5 times the critical current. Thus, The main goal of this paper is to clarify transient electromagnetic and thermal behaviors and mechanism of the high thermal stability in an NI REBCO coil. A partial element equivalent circuit (PEEC) model is proposed for the numerical simulation of an NI REBCO coil, which considers a local electrical contact resistance between turns, an $I\mbox{ - } V$ characteristic of an REBCO tape, and local self and mutual inductances of the NI REBCO coil. Using the PEEC model, we investigate the influence of the turn-to-turn contact resistance on the transient behavior of the NI REBCO coil during sudden discharging. We also perform thermal conduction analyses with the PEEC model to clarify the transient behavior of an NI REBCO coil during an overcurrent operation.

    Original languageEnglish
    Article number7010920
    JournalIEEE Transactions on Applied Superconductivity
    Volume25
    Issue number3
    DOIs
    Publication statusPublished - 2015 Jun 1

    Fingerprint

    insulation
    Insulation
    coils
    Equivalent circuits
    equivalent circuits
    Contact resistance
    Thermodynamic stability
    contact resistance
    thermal stability
    Critical currents
    burnout
    Inductance
    Temperature
    Tapes
    inductance
    tapes
    margins
    critical current
    Computer simulation
    electromagnetism

    Keywords

    • High-temperature superconductor
    • no-insulation (NI) coil
    • partial element equivalent circuit (PEEC

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering
    • Condensed Matter Physics
    • Electronic, Optical and Magnetic Materials

    Cite this

    Analyses of transient behaviors of no-insulation REBCO pancake coils during sudden discharging and overcurrent. / Wang, Tao; Noguchi, So; Wang, Xudong; Arakawa, Issei; Minami, Katsuhiko; Monma, Katsutoshi; Ishiyama, Atsushi; Hahn, Seungyong; Iwasa, Yukikazu.

    In: IEEE Transactions on Applied Superconductivity, Vol. 25, No. 3, 7010920, 01.06.2015.

    Research output: Contribution to journalArticle

    Wang, Tao ; Noguchi, So ; Wang, Xudong ; Arakawa, Issei ; Minami, Katsuhiko ; Monma, Katsutoshi ; Ishiyama, Atsushi ; Hahn, Seungyong ; Iwasa, Yukikazu. / Analyses of transient behaviors of no-insulation REBCO pancake coils during sudden discharging and overcurrent. In: IEEE Transactions on Applied Superconductivity. 2015 ; Vol. 25, No. 3.
    @article{b46fa5d2807d48a2be17eaa6080553aa,
    title = "Analyses of transient behaviors of no-insulation REBCO pancake coils during sudden discharging and overcurrent",
    abstract = "Stability margin of a high-temperature superconducting (HTS) coil is two or three orders of magnitude greater than that of a low-temperature superconducting coil. In recent years, many papers have reported test results of turn-to-turn no-insulation (NI) HTS coils having extremely enhanced thermal stability, such that burnout never occurs in an NI coil, even at an operating current exceeding 2.5 times the critical current. Thus, The main goal of this paper is to clarify transient electromagnetic and thermal behaviors and mechanism of the high thermal stability in an NI REBCO coil. A partial element equivalent circuit (PEEC) model is proposed for the numerical simulation of an NI REBCO coil, which considers a local electrical contact resistance between turns, an $I\mbox{ - } V$ characteristic of an REBCO tape, and local self and mutual inductances of the NI REBCO coil. Using the PEEC model, we investigate the influence of the turn-to-turn contact resistance on the transient behavior of the NI REBCO coil during sudden discharging. We also perform thermal conduction analyses with the PEEC model to clarify the transient behavior of an NI REBCO coil during an overcurrent operation.",
    keywords = "High-temperature superconductor, no-insulation (NI) coil, partial element equivalent circuit (PEEC",
    author = "Tao Wang and So Noguchi and Xudong Wang and Issei Arakawa and Katsuhiko Minami and Katsutoshi Monma and Atsushi Ishiyama and Seungyong Hahn and Yukikazu Iwasa",
    year = "2015",
    month = "6",
    day = "1",
    doi = "10.1109/TASC.2015.2393058",
    language = "English",
    volume = "25",
    journal = "IEEE Transactions on Applied Superconductivity",
    issn = "1051-8223",
    publisher = "Institute of Electrical and Electronics Engineers Inc.",
    number = "3",

    }

    TY - JOUR

    T1 - Analyses of transient behaviors of no-insulation REBCO pancake coils during sudden discharging and overcurrent

    AU - Wang, Tao

    AU - Noguchi, So

    AU - Wang, Xudong

    AU - Arakawa, Issei

    AU - Minami, Katsuhiko

    AU - Monma, Katsutoshi

    AU - Ishiyama, Atsushi

    AU - Hahn, Seungyong

    AU - Iwasa, Yukikazu

    PY - 2015/6/1

    Y1 - 2015/6/1

    N2 - Stability margin of a high-temperature superconducting (HTS) coil is two or three orders of magnitude greater than that of a low-temperature superconducting coil. In recent years, many papers have reported test results of turn-to-turn no-insulation (NI) HTS coils having extremely enhanced thermal stability, such that burnout never occurs in an NI coil, even at an operating current exceeding 2.5 times the critical current. Thus, The main goal of this paper is to clarify transient electromagnetic and thermal behaviors and mechanism of the high thermal stability in an NI REBCO coil. A partial element equivalent circuit (PEEC) model is proposed for the numerical simulation of an NI REBCO coil, which considers a local electrical contact resistance between turns, an $I\mbox{ - } V$ characteristic of an REBCO tape, and local self and mutual inductances of the NI REBCO coil. Using the PEEC model, we investigate the influence of the turn-to-turn contact resistance on the transient behavior of the NI REBCO coil during sudden discharging. We also perform thermal conduction analyses with the PEEC model to clarify the transient behavior of an NI REBCO coil during an overcurrent operation.

    AB - Stability margin of a high-temperature superconducting (HTS) coil is two or three orders of magnitude greater than that of a low-temperature superconducting coil. In recent years, many papers have reported test results of turn-to-turn no-insulation (NI) HTS coils having extremely enhanced thermal stability, such that burnout never occurs in an NI coil, even at an operating current exceeding 2.5 times the critical current. Thus, The main goal of this paper is to clarify transient electromagnetic and thermal behaviors and mechanism of the high thermal stability in an NI REBCO coil. A partial element equivalent circuit (PEEC) model is proposed for the numerical simulation of an NI REBCO coil, which considers a local electrical contact resistance between turns, an $I\mbox{ - } V$ characteristic of an REBCO tape, and local self and mutual inductances of the NI REBCO coil. Using the PEEC model, we investigate the influence of the turn-to-turn contact resistance on the transient behavior of the NI REBCO coil during sudden discharging. We also perform thermal conduction analyses with the PEEC model to clarify the transient behavior of an NI REBCO coil during an overcurrent operation.

    KW - High-temperature superconductor

    KW - no-insulation (NI) coil

    KW - partial element equivalent circuit (PEEC

    UR - http://www.scopus.com/inward/record.url?scp=84924033827&partnerID=8YFLogxK

    UR - http://www.scopus.com/inward/citedby.url?scp=84924033827&partnerID=8YFLogxK

    U2 - 10.1109/TASC.2015.2393058

    DO - 10.1109/TASC.2015.2393058

    M3 - Article

    AN - SCOPUS:84924033827

    VL - 25

    JO - IEEE Transactions on Applied Superconductivity

    JF - IEEE Transactions on Applied Superconductivity

    SN - 1051-8223

    IS - 3

    M1 - 7010920

    ER -