Analysis of edge and corner bonded PSvfBGA reliability under thermal cycling conditions by experimental and finite element methods

Hongbin Shi; F. X. Che; Cuihua Tian; Rui Zhang; Jong Tae Park; Toshitsugu Ueda

doi:10.1016/j.microrel.2012.06.089

Analysis of edge and corner bonded PSvfBGA reliability under thermal cycling conditions by experimental and finite element methods

Hongbin Shi, F. X. Che, Cuihua Tian, Rui Zhang, Jong Tae Park, Toshitsugu Ueda

Research output: Contribution to journal › Article

15 Citations (Scopus)

Abstract

In this paper, we present the thermal cycling test results for edge and corner bonded lead-free PSvfBGAs on a high-T _g test board. The test results show that the characteristic lives of PSvfBGAs with edge bond acrylic, edge bond epoxy and corner bond epoxy are respectively about 0.6, 0.9 and 1.3 times of the PSvfBGAs without bonding. The epoxy with lowest CTE, highest storage modulus and smallest adhesive volume yielded best performance. The 3D quarter finite element model was also built to further study the failure mechanism.

Original language	English
Pages (from-to)	1870-1875
Number of pages	6
Journal	Microelectronics Reliability
Volume	52
Issue number	9-10
DOIs	https://doi.org/10.1016/j.microrel.2012.06.089
Publication status	Published - 2012 Sep

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ASJC Scopus subject areas

Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials
Surfaces, Coatings and Films
Atomic and Molecular Physics, and Optics
Condensed Matter Physics
Safety, Risk, Reliability and Quality

Cite this

Shi, H., Che, F. X., Tian, C., Zhang, R., Park, J. T., & Ueda, T. (2012). Analysis of edge and corner bonded PSvfBGA reliability under thermal cycling conditions by experimental and finite element methods. Microelectronics Reliability, 52(9-10), 1870-1875. https://doi.org/10.1016/j.microrel.2012.06.089

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Access to Document

10.1016/j.microrel.2012.06.089