Analysis of edge and corner bonded PSvfBGA reliability under thermal cycling conditions by experimental and finite element methods

Hongbin Shi; F. X. Che; Cuihua Tian; Rui Zhang; Jong Tae Park; Toshitsugu Ueda

doi:10.1016/j.microrel.2012.06.089

Analysis of edge and corner bonded PSvfBGA reliability under thermal cycling conditions by experimental and finite element methods

Hongbin Shi, F. X. Che, Cuihua Tian, Rui Zhang, Jong Tae Park, Toshitsugu Ueda

Research output: Contribution to journal › Article › peer-review

16 Citations (Scopus)

Abstract

In this paper, we present the thermal cycling test results for edge and corner bonded lead-free PSvfBGAs on a high-T _g test board. The test results show that the characteristic lives of PSvfBGAs with edge bond acrylic, edge bond epoxy and corner bond epoxy are respectively about 0.6, 0.9 and 1.3 times of the PSvfBGAs without bonding. The epoxy with lowest CTE, highest storage modulus and smallest adhesive volume yielded best performance. The 3D quarter finite element model was also built to further study the failure mechanism.

Original language	English
Pages (from-to)	1870-1875
Number of pages	6
Journal	Microelectronics Reliability
Volume	52
Issue number	9-10
DOIs	https://doi.org/10.1016/j.microrel.2012.06.089
Publication status	Published - 2012 Sep

ASJC Scopus subject areas

Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials
Surfaces, Coatings and Films
Atomic and Molecular Physics, and Optics
Condensed Matter Physics
Safety, Risk, Reliability and Quality

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title = "Analysis of edge and corner bonded PSvfBGA reliability under thermal cycling conditions by experimental and finite element methods",

abstract = "In this paper, we present the thermal cycling test results for edge and corner bonded lead-free PSvfBGAs on a high-T g test board. The test results show that the characteristic lives of PSvfBGAs with edge bond acrylic, edge bond epoxy and corner bond epoxy are respectively about 0.6, 0.9 and 1.3 times of the PSvfBGAs without bonding. The epoxy with lowest CTE, highest storage modulus and smallest adhesive volume yielded best performance. The 3D quarter finite element model was also built to further study the failure mechanism.",

author = "Hongbin Shi and Che, {F. X.} and Cuihua Tian and Rui Zhang and Park, {Jong Tae} and Toshitsugu Ueda",

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AU - Shi, Hongbin

AU - Che, F. X.

AU - Tian, Cuihua

AU - Zhang, Rui

AU - Park, Jong Tae

AU - Ueda, Toshitsugu

PY - 2012/9

Y1 - 2012/9

N2 - In this paper, we present the thermal cycling test results for edge and corner bonded lead-free PSvfBGAs on a high-T g test board. The test results show that the characteristic lives of PSvfBGAs with edge bond acrylic, edge bond epoxy and corner bond epoxy are respectively about 0.6, 0.9 and 1.3 times of the PSvfBGAs without bonding. The epoxy with lowest CTE, highest storage modulus and smallest adhesive volume yielded best performance. The 3D quarter finite element model was also built to further study the failure mechanism.

AB - In this paper, we present the thermal cycling test results for edge and corner bonded lead-free PSvfBGAs on a high-T g test board. The test results show that the characteristic lives of PSvfBGAs with edge bond acrylic, edge bond epoxy and corner bond epoxy are respectively about 0.6, 0.9 and 1.3 times of the PSvfBGAs without bonding. The epoxy with lowest CTE, highest storage modulus and smallest adhesive volume yielded best performance. The 3D quarter finite element model was also built to further study the failure mechanism.

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Analysis of edge and corner bonded PSvfBGA reliability under thermal cycling conditions by experimental and finite element methods

Abstract

ASJC Scopus subject areas

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