Analysis of edge and corner bonded PSvfBGA reliability under thermal cycling conditions by experimental and finite element methods

Hongbin Shi, F. X. Che, Cuihua Tian, Rui Zhang, Jong Tae Park, Toshitsugu Ueda

    Research output: Contribution to journal › Article

    15 Citations (Scopus)

    Abstract

    In this paper, we present the thermal cycling test results for edge and corner bonded lead-free PSvfBGAs on a high-T g test board. The test results show that the characteristic lives of PSvfBGAs with edge bond acrylic, edge bond epoxy and corner bond epoxy are respectively about 0.6, 0.9 and 1.3 times of the PSvfBGAs without bonding. The epoxy with lowest CTE, highest storage modulus and smallest adhesive volume yielded best performance. The 3D quarter finite element model was also built to further study the failure mechanism.

    Original languageEnglish
    Pages (from-to)1870-1875
    Number of pages6
    JournalMicroelectronics Reliability
    Volume52
    Issue number9-10
    DOIs
    Publication statusPublished - 2012 Sep

    Fingerprint

    Thermal cycling
    Acrylics
    Adhesives
    finite element method
    Lead
    Elastic moduli
    Finite element method
    cycles
    thermal cycling tests
    adhesives

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering
    • Electronic, Optical and Magnetic Materials
    • Surfaces, Coatings and Films
    • Atomic and Molecular Physics, and Optics
    • Condensed Matter Physics
    • Safety, Risk, Reliability and Quality

    Cite this

    Analysis of edge and corner bonded PSvfBGA reliability under thermal cycling conditions by experimental and finite element methods. / Shi, Hongbin; Che, F. X.; Tian, Cuihua; Zhang, Rui; Park, Jong Tae; Ueda, Toshitsugu.

    In: Microelectronics Reliability, Vol. 52, No. 9-10, 09.2012, p. 1870-1875.

    Research output: Contribution to journal › Article

    Shi, H, Che, FX, Tian, C, Zhang, R, Park, JT & Ueda, T 2012, 'Analysis of edge and corner bonded PSvfBGA reliability under thermal cycling conditions by experimental and finite element methods', Microelectronics Reliability, vol. 52, no. 9-10, pp. 1870-1875. https://doi.org/10.1016/j.microrel.2012.06.089
    Shi H, Che FX, Tian C, Zhang R, Park JT, Ueda T. Analysis of edge and corner bonded PSvfBGA reliability under thermal cycling conditions by experimental and finite element methods. Microelectronics Reliability. 2012 Sep;52(9-10):1870-1875. https://doi.org/10.1016/j.microrel.2012.06.089
    Shi, Hongbin ; Che, F. X. ; Tian, Cuihua ; Zhang, Rui ; Park, Jong Tae ; Ueda, Toshitsugu. / Analysis of edge and corner bonded PSvfBGA reliability under thermal cycling conditions by experimental and finite element methods. In: Microelectronics Reliability. 2012 ; Vol. 52, No. 9-10. pp. 1870-1875.
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