Analysis of EHD pump with planer electrodes using FEM simulation

Yu Kuwajima, Shingo Maeda, Hiroki Shigemune

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Abstract

    As an aim to suppress the size of soft robotic system, we focused on to employ ElectroHydroDynamics (EHD), which occurs flow of fluid by applying voltage. EHD is a phenomenon induced by an interaction between fluid and electric field. In this paper, we fabricated EHD pumps with a 3D printer (Formlabs, Form 2) and a desktop cutting machine (SilhouetteCAMEO2). We employed double parallel electrodes composed of four planar electrodes into the flow channel. Different wiring patterns can be adopted with four planer electrodes. We measured the performance of the pumps on each wiring patterns. We compared results between the pressure generated with EHD pumps and electric field simulated using Finite Element Method (FEM) software (COMSOL). We analyzed distribution of electric field and voltage. From our results, we found that pressure increases as electric field increases in the system. In future work, we would use the simulation software to estimate the pressure generated by the EHD pumps and to optimize layout of electrodes.

    Original languageEnglish
    Title of host publicationMHS 2017 - 28th 2017 International Symposium on Micro-NanoMechatronics and Human Science
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    Pages1-3
    Number of pages3
    Volume2018-January
    ISBN (Electronic)9781538633144
    DOIs
    Publication statusPublished - 2018 Feb 28
    Event28th International Symposium on Micro-NanoMechatronics and Human Science, MHS 2017 - Nagoya, Japan
    Duration: 2017 Dec 32017 Dec 6

    Other

    Other28th International Symposium on Micro-NanoMechatronics and Human Science, MHS 2017
    CountryJapan
    CityNagoya
    Period17/12/317/12/6

    Fingerprint

    Electrohydrodynamics
    Electrodes
    Pumps
    Finite element method
    Electric fields
    Pressure
    Electric wiring
    Software
    3D printers
    Robotics
    Electric potential
    Channel flow
    Flow of fluids
    Fluids

    ASJC Scopus subject areas

    • Biotechnology
    • Biomedical Engineering
    • Electrical and Electronic Engineering
    • Mechanical Engineering

    Cite this

    Kuwajima, Y., Maeda, S., & Shigemune, H. (2018). Analysis of EHD pump with planer electrodes using FEM simulation. In MHS 2017 - 28th 2017 International Symposium on Micro-NanoMechatronics and Human Science (Vol. 2018-January, pp. 1-3). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MHS.2017.8305176

    Analysis of EHD pump with planer electrodes using FEM simulation. / Kuwajima, Yu; Maeda, Shingo; Shigemune, Hiroki.

    MHS 2017 - 28th 2017 International Symposium on Micro-NanoMechatronics and Human Science. Vol. 2018-January Institute of Electrical and Electronics Engineers Inc., 2018. p. 1-3.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Kuwajima, Y, Maeda, S & Shigemune, H 2018, Analysis of EHD pump with planer electrodes using FEM simulation. in MHS 2017 - 28th 2017 International Symposium on Micro-NanoMechatronics and Human Science. vol. 2018-January, Institute of Electrical and Electronics Engineers Inc., pp. 1-3, 28th International Symposium on Micro-NanoMechatronics and Human Science, MHS 2017, Nagoya, Japan, 17/12/3. https://doi.org/10.1109/MHS.2017.8305176
    Kuwajima Y, Maeda S, Shigemune H. Analysis of EHD pump with planer electrodes using FEM simulation. In MHS 2017 - 28th 2017 International Symposium on Micro-NanoMechatronics and Human Science. Vol. 2018-January. Institute of Electrical and Electronics Engineers Inc. 2018. p. 1-3 https://doi.org/10.1109/MHS.2017.8305176
    Kuwajima, Yu ; Maeda, Shingo ; Shigemune, Hiroki. / Analysis of EHD pump with planer electrodes using FEM simulation. MHS 2017 - 28th 2017 International Symposium on Micro-NanoMechatronics and Human Science. Vol. 2018-January Institute of Electrical and Electronics Engineers Inc., 2018. pp. 1-3
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