Anodic bonding below 180 °C for packaging and assembling of MEMS using lithium aluminosilicate-β-quartz glass-ceramic

Shuichi Shoji, Hiroto Kikuchi, Hirotaka Torigoe

Research output: Contribution to conferencePaper

19 Citations (Scopus)

Abstract

Silicon-to-glass anodic bonding is performed at temperature below 180 °C using lithium aluminosilicate - β-quartz glass-ceramic. High alkaline ion mobility at low temperature which is required for bonding and thermal expansion coefficient matching to Si is realized by controlling the composition of the glass-ceramic. Bonding is obtained at the lowest temperature of 140 °C. Useful bonding conditions are temperature above 160 °C (applied voltage of above 500 V). Since the etch rate of the glass-ceramic is five times higher than that of Pyrex glass in HF wet etching and the undercut is very small with Cr-Au etch mask, three dimensional structures are easily fabricated. Low temperature anodic bonding using this type of glass-ceramic is useful for the packaging and assembling of MEMS.

Original languageEnglish
Pages482-487
Number of pages6
Publication statusPublished - 1997 Jan 1
EventProceedings of the 1997 10th Annual International Workshop on Micro Electro Mechanical Systems, MEMS - Nagoya, Jpn
Duration: 1997 Jan 261997 Jan 30

Other

OtherProceedings of the 1997 10th Annual International Workshop on Micro Electro Mechanical Systems, MEMS
CityNagoya, Jpn
Period97/1/2697/1/30

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Mechanical Engineering
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Anodic bonding below 180 °C for packaging and assembling of MEMS using lithium aluminosilicate-β-quartz glass-ceramic'. Together they form a unique fingerprint.

  • Cite this

    Shoji, S., Kikuchi, H., & Torigoe, H. (1997). Anodic bonding below 180 °C for packaging and assembling of MEMS using lithium aluminosilicate-β-quartz glass-ceramic. 482-487. Paper presented at Proceedings of the 1997 10th Annual International Workshop on Micro Electro Mechanical Systems, MEMS, Nagoya, Jpn, .