Application of electronic devices for aerosol deposition methods

Masafumi Nakada, Toshihiro Kawakami, Mizuki Iwanami, Keishi Ohashi

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

Oxide materials have superior functional characteristics that are attributed to their versatile structures and chemically stable characteristics. These characteristics are expected to enable their employment as the functional device materials that are required to support the ubiquitous society. The aerosol deposition method is a nanocrystalline film forming method that employs the impact solidification phenomenon of ultra fine particles. This method enables the formation of oxide films onto any type of substrate. NEC and NEC TOKIN are co-developing piezoelectric and optical device products to be used in the aerosol deposition.

Original languageEnglish
Pages (from-to)76-80
Number of pages5
JournalNEC Technical Journal
Volume2
Issue number1
Publication statusPublished - 2007
Externally publishedYes

Fingerprint

Aerosols
Piezoelectric devices
Optical devices
Oxides
Oxide films
Solidification
Substrates

Keywords

  • Aerosol deposition
  • Electric field sensor
  • Fiber sensor
  • Film forming technology
  • Optical modulator
  • Piezoelectric device

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Materials Science(all)
  • Hardware and Architecture
  • Information Systems

Cite this

Application of electronic devices for aerosol deposition methods. / Nakada, Masafumi; Kawakami, Toshihiro; Iwanami, Mizuki; Ohashi, Keishi.

In: NEC Technical Journal, Vol. 2, No. 1, 2007, p. 76-80.

Research output: Contribution to journalArticle

Nakada, M, Kawakami, T, Iwanami, M & Ohashi, K 2007, 'Application of electronic devices for aerosol deposition methods', NEC Technical Journal, vol. 2, no. 1, pp. 76-80.
Nakada, Masafumi ; Kawakami, Toshihiro ; Iwanami, Mizuki ; Ohashi, Keishi. / Application of electronic devices for aerosol deposition methods. In: NEC Technical Journal. 2007 ; Vol. 2, No. 1. pp. 76-80.
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