Application of I-structure though-glass interconnect filled with submicron gold particles to a hermetic sealing device

Kazuya Nomura, Akiko Okada, Shuichi Shoji, Toshinori Ogashiwa, Jun Mizuno

Research output: Contribution to journalArticle

4 Citations (Scopus)

Abstract

We propose hermetic sealing of a glass-to-glass structure with an I-structure through-glass interconnect via (TGV) filled with submicron Au particles. The top and bottom bumps and the TGV were formed by a simple filling process with a bump-patterned dry film resist. The sealing devices consisting of two glass substrates were bonded via Au interlayers. Vacuum ultraviolet irradiation in the presence of oxygen gas (VUV/O3) pretreatment was used for low-temperature Au-Au bonding at 200 °C. The bonded samples showed He leakage rates of less than 1.3 × 10-9 Pa m3 s-1. The cross-sectional scanning electron microscope images of the fabricated I-structure TGV showed perfect adhesion between the I-structure TGV and glass substrate. These results indicate that the proposed I-structure TGV is suitable for hermetic sealing devices.

Original languageEnglish
Article number105018
JournalJournal of Micromechanics and Microengineering
Volume26
Issue number10
DOIs
Publication statusPublished - 2016 Sep 19

Keywords

  • 3D integration
  • daisy chain
  • glass-to-glass structure
  • gold particles
  • hermetic sealing
  • low-temperature bonding
  • VUV/O treatment

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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