Abstract
Electroless deposition process for fabricating magnetic dot arrays was studied. A patterned Si substrate with a SiO2 resist was produced by processes combined with electron-beam lithography and reactive ion etching. By immersing the patterned Si substrate into a CoNiP electroless deposition bath, CoNiP was deposited only into the patterned pores, demonstrating a satisfactory area selectivity of the deposition. Excellent uniformity on the CoNiP deposition into the patterned pores with diameter less than 100 nm and high aspect ratio (> 5) was achieved by applying chemical activation processes using a Pd solution prior to the deposition. The CoNiP dot arrays exhibited higher perpendicular squareness ratio than that of CoNiP continuous film and showed a clear magnetization state at DC-magnetized state, which originated from the shape anisotropy caused by high aspect ratio of the dot patterns.
Original language | English |
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Pages (from-to) | 245-249 |
Number of pages | 5 |
Journal | Journal of Magnetism and Magnetic Materials |
Volume | 287 |
Issue number | SPEC. ISS. |
DOIs | |
Publication status | Published - 2005 Feb 1 |
Keywords
- Area selective formation
- CoNiP alloys
- Electroless deposition
- Patterned media
- Pd activation process
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics