Athermal Silicon photonic devices using hybrid polymer cladding

Tomohiro Kita, Freddy Susanto Tan, Okihiro Sugihara, Hirohito Yamada, Toshikuni Kaino

Research output: Contribution to conferencePaper

Abstract

The compensation of sensitivity for ambient temperature is big issue to realize Silicon photonic integrated circuits. The large positive thermo-optic coefficient of Silicon core was cancelled by the negative thermooptic coefficient of hybrid polymer cladding including rutile TiO2 nanoparticles. The athermal waveguide structure with Silicon core and Hybrid polymer cladding was designed by numerical calculation.

Original languageEnglish
Pages272-275
Number of pages4
Publication statusPublished - 2014 Jan 1
Externally publishedYes
Event23rd International Conference on Plastic Optical Fibers, POF 2014 - Hiyoshi, Yokohama, Japan
Duration: 2014 Oct 82014 Oct 10

Other

Other23rd International Conference on Plastic Optical Fibers, POF 2014
CountryJapan
CityHiyoshi, Yokohama
Period14/10/814/10/10

Keywords

  • Hybrid polymer
  • Silicon photonics
  • Thermo-optic effect
  • TiO nanoparticles

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Materials Chemistry
  • Polymers and Plastics

Fingerprint Dive into the research topics of 'Athermal Silicon photonic devices using hybrid polymer cladding'. Together they form a unique fingerprint.

  • Cite this

    Kita, T., Tan, F. S., Sugihara, O., Yamada, H., & Kaino, T. (2014). Athermal Silicon photonic devices using hybrid polymer cladding. 272-275. Paper presented at 23rd International Conference on Plastic Optical Fibers, POF 2014, Hiyoshi, Yokohama, Japan.