BACKSCATTERING FACTOR IN Au-Cu ALLOYS FOR QUANTITATIVE ANALYSIS BY SCANNING AUGER ELECTRON MICROSCOPY.

Shingo Ichimura, R. Shimizu, T. Ikuta

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

This work was attempted to examine the validity of the backscattering factors by applying them to the quantitative Auger analysis of sputter-deposited Ni-Pt layer which is probably the most appropriate test sample of known concentration for surface analysis. The surface composition of the sputter-deposited layer determined by this quantitative analysis method agrees well with the bulk composition of sputter Ni-Pt sample. Then this approach was applied to study preferential sputtering in Au-Cu alloys. The surface composition of sputtered Au-Cu alloy sample, which is quantified similar to the Ni-Pt alloy, is in very good agreement with the bulk composition of the sputtered Au-Cu alloy.

Original languageEnglish
Pages (from-to)231-236
Number of pages6
JournalScanning Electron Microscopy
Publication statusPublished - 1981 Jan 1
Externally publishedYes

Fingerprint

Electron Scanning Microscopy
Electron microscopy
Scanning
Chemical analysis
Surface structure
Surface analysis
Backscattering
Sputtering

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Biophysics

Cite this

BACKSCATTERING FACTOR IN Au-Cu ALLOYS FOR QUANTITATIVE ANALYSIS BY SCANNING AUGER ELECTRON MICROSCOPY. / Ichimura, Shingo; Shimizu, R.; Ikuta, T.

In: Scanning Electron Microscopy, 01.01.1981, p. 231-236.

Research output: Contribution to journalArticle

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