BACKSCATTERING FACTOR IN Au-Cu ALLOYS FOR QUANTITATIVE ANALYSIS BY SCANNING AUGER ELECTRON MICROSCOPY.

S. Ichimura, R. Shimizu, T. Ikuta

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

This work was attempted to examine the validity of the backscattering factors by applying them to the quantitative Auger analysis of sputter-deposited Ni-Pt layer which is probably the most appropriate test sample of known concentration for surface analysis. The surface composition of the sputter-deposited layer determined by this quantitative analysis method agrees well with the bulk composition of sputter Ni-Pt sample. Then this approach was applied to study preferential sputtering in Au-Cu alloys. The surface composition of sputtered Au-Cu alloy sample, which is quantified similar to the Ni-Pt alloy, is in very good agreement with the bulk composition of the sputtered Au-Cu alloy.

Original languageEnglish
Pages (from-to)231-236
Number of pages6
JournalScanning Electron Microscopy
Publication statusPublished - 1981 Jan 1
Externally publishedYes

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Biophysics

Fingerprint Dive into the research topics of 'BACKSCATTERING FACTOR IN Au-Cu ALLOYS FOR QUANTITATIVE ANALYSIS BY SCANNING AUGER ELECTRON MICROSCOPY.'. Together they form a unique fingerprint.

  • Cite this