BEHAVIOR OF Pd/Sn AND Pd CATALYSTS FOR ELECTROLESS PLATING ON DIFFERENT SUBSTRATES INVESTIGATED BY MEANS OF RUTHERFORD BACKSCATTERING SPECTROSCOPY.

Leo G. Svendsen, Tetsuya Osaka, Hideo Sawai

Research output: Contribution to journalArticle

34 Citations (Scopus)

Abstract

Two catalytic systems for electroless metal deposition have been investigated by means of Rutherford backscattering spectrometry (RBS). The well-known tin sensitizer, palladium activator, two-step catalyst had the main emphasis, but also a commercial one based on evaporated palladium was examined. The behavior of the two-step catalyst was largely dependent on the substrates used. On Al//2O//3, the Sn:Pd ratio was 1:1 with 1. 3 multiplied by 10**1**5 atoms/cm**2 each. On carbon substrates, the Sn:Pd ratio was 1:4 with 6 multiplied by 10**1**5 tin atoms/cm**2 and 24 multiplied by 10**1**5 palladium atoms/cm**2. Both these results violate the simple reaction palladium atoms/cm**2 on the surface behaved differently compared to the two-step catalyst by diffusing into the deposited layer and thereby influencing its deposition rate.

Original languageEnglish
Pages (from-to)2252-2255
Number of pages4
JournalJournal of the Electrochemical Society
Volume130
Issue number11
Publication statusPublished - 1983 Nov

Fingerprint

Electroless plating
Rutherford backscattering spectroscopy
Palladium
plating
palladium
backscattering
catalysts
Atoms
Catalysts
Tin
Substrates
spectroscopy
atoms
tin
Deposition rates
Spectrometry
Carbon
Metals
carbon
metals

ASJC Scopus subject areas

  • Electrochemistry
  • Surfaces, Coatings and Films
  • Surfaces and Interfaces

Cite this

@article{8c6b6d7aa51848d2acf5d263be4e346b,
title = "BEHAVIOR OF Pd/Sn AND Pd CATALYSTS FOR ELECTROLESS PLATING ON DIFFERENT SUBSTRATES INVESTIGATED BY MEANS OF RUTHERFORD BACKSCATTERING SPECTROSCOPY.",
abstract = "Two catalytic systems for electroless metal deposition have been investigated by means of Rutherford backscattering spectrometry (RBS). The well-known tin sensitizer, palladium activator, two-step catalyst had the main emphasis, but also a commercial one based on evaporated palladium was examined. The behavior of the two-step catalyst was largely dependent on the substrates used. On Al//2O//3, the Sn:Pd ratio was 1:1 with 1. 3 multiplied by 10**1**5 atoms/cm**2 each. On carbon substrates, the Sn:Pd ratio was 1:4 with 6 multiplied by 10**1**5 tin atoms/cm**2 and 24 multiplied by 10**1**5 palladium atoms/cm**2. Both these results violate the simple reaction palladium atoms/cm**2 on the surface behaved differently compared to the two-step catalyst by diffusing into the deposited layer and thereby influencing its deposition rate.",
author = "Svendsen, {Leo G.} and Tetsuya Osaka and Hideo Sawai",
year = "1983",
month = "11",
language = "English",
volume = "130",
pages = "2252--2255",
journal = "Journal of the Electrochemical Society",
issn = "0013-4651",
publisher = "Electrochemical Society, Inc.",
number = "11",

}

TY - JOUR

T1 - BEHAVIOR OF Pd/Sn AND Pd CATALYSTS FOR ELECTROLESS PLATING ON DIFFERENT SUBSTRATES INVESTIGATED BY MEANS OF RUTHERFORD BACKSCATTERING SPECTROSCOPY.

AU - Svendsen, Leo G.

AU - Osaka, Tetsuya

AU - Sawai, Hideo

PY - 1983/11

Y1 - 1983/11

N2 - Two catalytic systems for electroless metal deposition have been investigated by means of Rutherford backscattering spectrometry (RBS). The well-known tin sensitizer, palladium activator, two-step catalyst had the main emphasis, but also a commercial one based on evaporated palladium was examined. The behavior of the two-step catalyst was largely dependent on the substrates used. On Al//2O//3, the Sn:Pd ratio was 1:1 with 1. 3 multiplied by 10**1**5 atoms/cm**2 each. On carbon substrates, the Sn:Pd ratio was 1:4 with 6 multiplied by 10**1**5 tin atoms/cm**2 and 24 multiplied by 10**1**5 palladium atoms/cm**2. Both these results violate the simple reaction palladium atoms/cm**2 on the surface behaved differently compared to the two-step catalyst by diffusing into the deposited layer and thereby influencing its deposition rate.

AB - Two catalytic systems for electroless metal deposition have been investigated by means of Rutherford backscattering spectrometry (RBS). The well-known tin sensitizer, palladium activator, two-step catalyst had the main emphasis, but also a commercial one based on evaporated palladium was examined. The behavior of the two-step catalyst was largely dependent on the substrates used. On Al//2O//3, the Sn:Pd ratio was 1:1 with 1. 3 multiplied by 10**1**5 atoms/cm**2 each. On carbon substrates, the Sn:Pd ratio was 1:4 with 6 multiplied by 10**1**5 tin atoms/cm**2 and 24 multiplied by 10**1**5 palladium atoms/cm**2. Both these results violate the simple reaction palladium atoms/cm**2 on the surface behaved differently compared to the two-step catalyst by diffusing into the deposited layer and thereby influencing its deposition rate.

UR - http://www.scopus.com/inward/record.url?scp=0020849231&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0020849231&partnerID=8YFLogxK

M3 - Article

VL - 130

SP - 2252

EP - 2255

JO - Journal of the Electrochemical Society

JF - Journal of the Electrochemical Society

SN - 0013-4651

IS - 11

ER -