Board-level solder joint reliability of edge-and corner-bonded lead-free chip scale package assemblies subjected to thermal cycling

Hongbin Shi, Cuihua Tian, Toshitsugu Ueda

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    Abstract

    In this paper, we present the results of thermal cycling test for edge- and corner-bonded lead-free chip scale packages (CSPs), which was carried out on the basis of the IPC-9701 test standard. Six materials were used in this study: four edge-bond adhesives and two corner-bond adhesives. These adhesives were compared with CSPs with full capillary flow underfill (FCFU) and without adhesives. The thermal cycling test results show that corner-bond adhesive has comparable solder joint reliability performance with CSP without adhesive, and is better than edge-bond adhesive, followed by CSPs with FCFU. In addition, the adhesives with a low coefficient of thermal expansion, a high glass transition temperature and a intermediate storage modulus yielded good performance. Results of detailed failure analysis indicate that the dominant failure mode is solder bulk fatigue cracking near package and/or printed circuit board (PCB) pads, and that the location of critical solder joints change from die edges to package corners with the introduction of adhesives.

    Original languageEnglish
    Article number04DB08
    JournalJapanese Journal of Applied Physics
    Volume51
    Issue number4 PART 2
    DOIs
    Publication statusPublished - 2012 Apr

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    ASJC Scopus subject areas

    • Engineering(all)
    • Physics and Astronomy(all)

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