Bond reliability of cost effective Au-Ag alloy wire

Tomohiro Uno, Kohei Tatsumi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Highly-alloyed Au-Ag bonding wire could be effective in saving material costs. We investigated the effects of Ag alloying on ball formation, bond strength and bond reliability. Even with high Ag concentration (approx. 50at%), ball was formed spherically. Bond strength and ball deformability were good enough for IC's assembling when concentration of Ag was less than 30at%. Thermal reliability of bonds between Au-Ag wire and Al pad had the unique dependence of Ag concentration. Ball bonds of Au-14at%Ag yielded significant degradation through annealed. On the contrary bonds of Au-24at%Ag provided as good reliability as a commercial pure Au wire after annealed at 473K-1000h. The bond reliability has the connection with intermetallic growth as well as diffusion behavior at the bond interface. The growth of intermetallics was different from that of pure Au/Al bonds. Optimizing the Ag concentration in the wire was effective in improving the bond reliability.

Original languageEnglish
Title of host publicationProceedings of SPIE - The International Society for Optical Engineering
PublisherSociety of Photo-Optical Instrumentation Engineers
Pages450-455
Number of pages6
Volume3906
Publication statusPublished - 1999
Externally publishedYes
EventProceedings of the 1999 International Symposium on Microelectronics - Chicago, IL, USA
Duration: 1999 Oct 261999 Oct 28

Other

OtherProceedings of the 1999 International Symposium on Microelectronics
CityChicago, IL, USA
Period99/10/2699/10/28

Fingerprint

wire
Wire
balls
costs
Costs
Intermetallics
intermetallics
Formability
assembling
Alloying
alloying
degradation
Degradation

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Condensed Matter Physics

Cite this

Uno, T., & Tatsumi, K. (1999). Bond reliability of cost effective Au-Ag alloy wire. In Proceedings of SPIE - The International Society for Optical Engineering (Vol. 3906, pp. 450-455). Society of Photo-Optical Instrumentation Engineers.

Bond reliability of cost effective Au-Ag alloy wire. / Uno, Tomohiro; Tatsumi, Kohei.

Proceedings of SPIE - The International Society for Optical Engineering. Vol. 3906 Society of Photo-Optical Instrumentation Engineers, 1999. p. 450-455.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Uno, T & Tatsumi, K 1999, Bond reliability of cost effective Au-Ag alloy wire. in Proceedings of SPIE - The International Society for Optical Engineering. vol. 3906, Society of Photo-Optical Instrumentation Engineers, pp. 450-455, Proceedings of the 1999 International Symposium on Microelectronics, Chicago, IL, USA, 99/10/26.
Uno T, Tatsumi K. Bond reliability of cost effective Au-Ag alloy wire. In Proceedings of SPIE - The International Society for Optical Engineering. Vol. 3906. Society of Photo-Optical Instrumentation Engineers. 1999. p. 450-455
Uno, Tomohiro ; Tatsumi, Kohei. / Bond reliability of cost effective Au-Ag alloy wire. Proceedings of SPIE - The International Society for Optical Engineering. Vol. 3906 Society of Photo-Optical Instrumentation Engineers, 1999. pp. 450-455
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