Bonding properties of low-temperature wafer bonding using sub-micron gold particles with different particle sizes

Hiroyuki Ishida, Toshinori Ogashiwa, Yukio Kanehira, Shin Ito, Takuya Yazaki, Shuichi Shoji, Jun Mizuno

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Low-temperature wafer bonding using sub-micron gold particles was investigated. Wafer-level pattern transfer method has also been developed to enable patterning on wafers with fragile structures such as MEMS devices. Sub-micron Au particle patterns with a width of 20 μm - 60 μm and a height around 20 μm were formed on 100mm-diameter glass wafers by means of wafer-level processing using photolithography and a slurry-filling technique, and then successfully transferred onto Si wafers in ambient atmosphere at a temperature of 150°C and an applied pressure of 20 MPa - 30 MPa. Wafer bonding was performed at 200°C, 100 MPa and exhibited a sufficient tensile strength of 45.8 MPa. A good hermeticity was also confirmed as He leak rate of < 1 × 10-9 Pa·m3/s. Compression deformation measurement was performed for patterns with different mean particle sizes of 0.3μm and 0.1μm and the performance on a-few-μm surface roughness absorption was demonstrated. Patterns with smaller size particles showed larger deformation, or more ability to absorb surface opography.

Original languageEnglish
Title of host publication2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2012 - Proceedings
Pages167-170
Number of pages4
DOIs
Publication statusPublished - 2012 Dec 1
Event2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2012 - Taipei, Taiwan, Province of China
Duration: 2012 Oct 242012 Oct 26

Publication series

NameProceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
ISSN (Print)2150-5934
ISSN (Electronic)2150-5942

Conference

Conference2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2012
CountryTaiwan, Province of China
CityTaipei
Period12/10/2412/10/26

ASJC Scopus subject areas

  • Hardware and Architecture
  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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    Ishida, H., Ogashiwa, T., Kanehira, Y., Ito, S., Yazaki, T., Shoji, S., & Mizuno, J. (2012). Bonding properties of low-temperature wafer bonding using sub-micron gold particles with different particle sizes. In 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2012 - Proceedings (pp. 167-170). [6420217] (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT). https://doi.org/10.1109/IMPACT.2012.6420217