Bonding properties of low-temperature wafer bonding using sub-micron gold particles with different particle sizes

Hiroyuki Ishida*, Toshinori Ogashiwa, Yukio Kanehira, Shin Ito, Takuya Yazaki, Shuichi Shoji, Jun Mizuno

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

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Engineering & Materials Science