Fingerprint
Dive into the research topics of 'Bonding properties of low-temperature wafer bonding using sub-micron gold particles with different particle sizes'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
Bonding properties of low-temperature wafer bonding using sub-micron gold particles with different particle sizes
Hiroyuki Ishida*, Toshinori Ogashiwa, Yukio Kanehira, Shin Ito, Takuya Yazaki, Shuichi Shoji, Jun Mizuno
*Corresponding author for this work
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
1
Citation
(Scopus)