Bottom-up fabrication for spinelectronic devices using oxide nanosheets

Minoru Osada, Takayoshi Sasaki

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We present a novel bottom-up fabrication for spin-electronics devices by using a new class of nanomaterial namely, a titania nanosheet derived from a layered titanate by exfoliation. Magnetic and magneto-optical measurements demonstrate that Co-substituted titania nanosheet (Ti0.8Co 0.2O2) acts as a ferromagnetic material at room temperature. We also demonstrate that the careful placements of ferromagnetic nanosheets into thin-film architectures on a microscopic chip allow a rational design and construction of advanced functional devices such as ferromagnetic superlattices, magneto-optical devices.

Original languageEnglish
Title of host publication4th IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies 2008, CICMT 2008
Pages176-181
Number of pages6
Publication statusPublished - 2008
Externally publishedYes
Event4th International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2008 - Munich, Germany
Duration: 2008 Apr 212008 Apr 24

Other

Other4th International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2008
CountryGermany
CityMunich
Period08/4/2108/4/24

Fingerprint

Nanosheets
Oxides
Fabrication
Magnetooptical devices
Titanium
Ferromagnetic materials
Superlattices
Nanostructured materials
Electronic equipment
Thin films
Temperature
titanium dioxide

Keywords

  • Bottom-up fabrication
  • Ferromagnetic semiconductor
  • Layer-by-layer assembly
  • Magneto-optical effect
  • Oxide nanosheet

ASJC Scopus subject areas

  • Hardware and Architecture
  • Ceramics and Composites

Cite this

Osada, M., & Sasaki, T. (2008). Bottom-up fabrication for spinelectronic devices using oxide nanosheets. In 4th IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies 2008, CICMT 2008 (pp. 176-181)

Bottom-up fabrication for spinelectronic devices using oxide nanosheets. / Osada, Minoru; Sasaki, Takayoshi.

4th IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies 2008, CICMT 2008. 2008. p. 176-181.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Osada, M & Sasaki, T 2008, Bottom-up fabrication for spinelectronic devices using oxide nanosheets. in 4th IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies 2008, CICMT 2008. pp. 176-181, 4th International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2008, Munich, Germany, 08/4/21.
Osada M, Sasaki T. Bottom-up fabrication for spinelectronic devices using oxide nanosheets. In 4th IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies 2008, CICMT 2008. 2008. p. 176-181
Osada, Minoru ; Sasaki, Takayoshi. / Bottom-up fabrication for spinelectronic devices using oxide nanosheets. 4th IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies 2008, CICMT 2008. 2008. pp. 176-181
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