Breakdown mechanism of plasma polymerized ethylene thin film

K. Ishii, Y. Ohki

Research output: Contribution to journalConference article

Original languageEnglish
Article number763342
Pages (from-to)102-107
Number of pages6
JournalAnnual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP
DOIs
Publication statusPublished - 1991 Jan 1
Event1991 Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 1991 - Knoxville, United States
Duration: 1991 Oct 201991 Oct 23

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Ethylene
Plasmas
Thin films
ethylene

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Cite this

Breakdown mechanism of plasma polymerized ethylene thin film. / Ishii, K.; Ohki, Y.

In: Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP, 01.01.1991, p. 102-107.

Research output: Contribution to journalConference article

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