Breakdown mechanism of plasma polymerized ethylene thin film

Research output: Contribution to journal › Conference article › peer-review

Original language	English
Article number	763342
Pages (from-to)	102-107
Number of pages	6
Journal	Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP
DOIs	https://doi.org/10.1109/CEIDP.1991.763342
Publication status	Published - 1991 Jan 1
Event	1991 Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 1991 - Knoxville, United States Duration: 1991 Oct 20 → 1991 Oct 23

ASJC Scopus subject areas

@article{3876a0bee0024a698316c5acb0c34f7d,

title = "Breakdown mechanism of plasma polymerized ethylene thin film",

author = "K. Ishii and Y. Ohki",

year = "1991",

month = jan,

day = "1",

doi = "10.1109/CEIDP.1991.763342",

language = "English",

pages = "102--107",

journal = "Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP",

issn = "0084-9162",

note = "1991 Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 1991 ; Conference date: 20-10-1991 Through 23-10-1991",

}

TY - JOUR

T1 - Breakdown mechanism of plasma polymerized ethylene thin film

AU - Ishii, K.

AU - Ohki, Y.

PY - 1991/1/1

Y1 - 1991/1/1

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U2 - 10.1109/CEIDP.1991.763342

DO - 10.1109/CEIDP.1991.763342

M3 - Conference article

AN - SCOPUS:85068331852

SN - 0084-9162

SP - 102

EP - 107

JO - Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP

JF - Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP

M1 - 763342

T2 - 1991 Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 1991

Y2 - 20 October 1991 through 23 October 1991

ER -