Breakdown strength at the interface between epoxy resin and silicone rubber

Kohei Shibata, Yoshimichi Ohki, T. Takahashi, T. Okamoto

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    1 Citation (Scopus)

    Abstract

    We have proposed a concept of an environment-conscious all-solid-insulated substation system as a next generation substation. In order to make the system compact and its layout flexible, it is required to develop a compact connection system with solid insulating materials. Hard and soft insulating materials are to be used for this connection system. Therefore, there is a concern about air penetration into their interface at the time of connection, which reduces the insulation performance. In order to simulate this situation, a model connection part was made using an epoxy resin board as the hard material and a silicone rubber board as the soft material with a spacer inserted into their interface. The present paper reports experimental results on the breakdown strength under ac and impulse voltages. It is confirmed that the insulation performance decreases with an increase in the thickness of the air layer between the two boards.

    Original languageEnglish
    Title of host publicationConference on Electrical Insulation and Dielectric Phenomena (CEIDP), Annual Report
    Pages289-292
    Number of pages4
    Publication statusPublished - 2003
    Event2003 Annual Report: Conference on Electrical Insulation and Dieletric Phenomena - Albuquerque, NM, United States
    Duration: 2003 Oct 192003 Oct 22

    Other

    Other2003 Annual Report: Conference on Electrical Insulation and Dieletric Phenomena
    CountryUnited States
    CityAlbuquerque, NM
    Period03/10/1903/10/22

    Fingerprint

    Insulating materials
    Epoxy resins
    Silicones
    Insulation
    Rubber
    Air
    Electric potential

    ASJC Scopus subject areas

    • Building and Construction
    • Industrial and Manufacturing Engineering
    • Electrical and Electronic Engineering

    Cite this

    Shibata, K., Ohki, Y., Takahashi, T., & Okamoto, T. (2003). Breakdown strength at the interface between epoxy resin and silicone rubber. In Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), Annual Report (pp. 289-292)

    Breakdown strength at the interface between epoxy resin and silicone rubber. / Shibata, Kohei; Ohki, Yoshimichi; Takahashi, T.; Okamoto, T.

    Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), Annual Report. 2003. p. 289-292.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Shibata, K, Ohki, Y, Takahashi, T & Okamoto, T 2003, Breakdown strength at the interface between epoxy resin and silicone rubber. in Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), Annual Report. pp. 289-292, 2003 Annual Report: Conference on Electrical Insulation and Dieletric Phenomena, Albuquerque, NM, United States, 03/10/19.
    Shibata K, Ohki Y, Takahashi T, Okamoto T. Breakdown strength at the interface between epoxy resin and silicone rubber. In Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), Annual Report. 2003. p. 289-292
    Shibata, Kohei ; Ohki, Yoshimichi ; Takahashi, T. ; Okamoto, T. / Breakdown strength at the interface between epoxy resin and silicone rubber. Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), Annual Report. 2003. pp. 289-292
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