Cavity-free micro thermoelectric energy harvester with Si nanowires

T. Watanabe, M. Tomita, T. Zhan, K. Shima, Y. Himeda, R. Yamato, T. Matsukawa, T. Matsuki

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We present a new design of silicon-based micro-thermoelectric generator, which utilizes silicon nanowires as the thermoelectric leg. It is driven by a steep temperature gradient exuding around a heat flow perpendicular to the substrate, and the silicon nanowires are not suspended on a cavity etched on the substrate. The power density is scalable by shortening the silicon nanowire to sub-μm length, which was experimentally demonstrated and tens of µW/cm2-class power generation was achieved at an externally applied temperature difference of only 5 K. A numerical discussion shows that the thermoelectric power can be drastically enhanced by suppressing the thermal resistance at the entire substrate. Thus, there is a plenty of room at the micro- or submicrometric scales for realizing thermal energy harvesting devices with high power densities.

Original languageEnglish
Title of host publicationSilicon Compatible Emerging Materials, Processes, and Technologies for Advanced CMOS and Post-CMOS Applications 9
EditorsK. Kakushima, Y. S. Obeng, E. P. Gusev, S. De Gendt, P. J. Timans, Z. Karim, F. Roozeboom, D. Misra, H. Jagannathan
PublisherElectrochemical Society Inc.
Pages95-110
Number of pages16
Edition3
ISBN (Electronic)9781607685395
DOIs
Publication statusPublished - 2019 Jan 1
EventInternational Symposium on Silicon Compatible Emerging Materials, Processes, and Technologies for Advanced CMOS and Post-CMOS Applications 9 - 235th ECS Meeting - Dallas, United States
Duration: 2019 May 262019 May 30

Publication series

NameECS Transactions
Number3
Volume89
ISSN (Print)1938-6737
ISSN (Electronic)1938-5862

Conference

ConferenceInternational Symposium on Silicon Compatible Emerging Materials, Processes, and Technologies for Advanced CMOS and Post-CMOS Applications 9 - 235th ECS Meeting
CountryUnited States
CityDallas
Period19/5/2619/5/30

ASJC Scopus subject areas

  • Engineering(all)

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