Cepstrum technique for multilayer structure characterization

X. M. Lu, J. M. Reid, Kawan Soetanto, L. Weng, V. Genis

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

The triple cepstrum, the third power of the inverse Fourier transform (IFT) of the logarithm of signal power spectrum, is used to characterize two-layer structures. The thickness of each layer can be found from the positions of the peaks in the triple cepstrum. Simulations and preliminary experiments have shown that the relative reflection coefficients can be reconstructed, in the ideal and lossless case, from the polarity and the amplitude of these peaks, as predicted by theory. The impedance pattern can be predicted even at low signal to noise ratio. A potential application of this method is to characterize blood vessel walls. The resulting thickness and impedance pattern could be useful in detecting and classifying plaques, particularly in the early stages.

Original languageEnglish
Title of host publicationUltrasonics Symposium Proceedings
PublisherPubl by IEEE
Pages1571-1574
Number of pages4
Volume3
Publication statusPublished - 1990
Externally publishedYes
EventProceedings of the IEEE 1990 Ultrasonics Symposium - Honolulu, HI, USA
Duration: 1990 Dec 41990 Dec 7

Other

OtherProceedings of the IEEE 1990 Ultrasonics Symposium
CityHonolulu, HI, USA
Period90/12/490/12/7

Fingerprint

Inverse transforms
Blood vessels
Power spectrum
Signal to noise ratio
Fourier transforms
Multilayers
Experiments

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Lu, X. M., Reid, J. M., Soetanto, K., Weng, L., & Genis, V. (1990). Cepstrum technique for multilayer structure characterization. In Ultrasonics Symposium Proceedings (Vol. 3, pp. 1571-1574). Publ by IEEE.

Cepstrum technique for multilayer structure characterization. / Lu, X. M.; Reid, J. M.; Soetanto, Kawan; Weng, L.; Genis, V.

Ultrasonics Symposium Proceedings. Vol. 3 Publ by IEEE, 1990. p. 1571-1574.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Lu, XM, Reid, JM, Soetanto, K, Weng, L & Genis, V 1990, Cepstrum technique for multilayer structure characterization. in Ultrasonics Symposium Proceedings. vol. 3, Publ by IEEE, pp. 1571-1574, Proceedings of the IEEE 1990 Ultrasonics Symposium, Honolulu, HI, USA, 90/12/4.
Lu XM, Reid JM, Soetanto K, Weng L, Genis V. Cepstrum technique for multilayer structure characterization. In Ultrasonics Symposium Proceedings. Vol. 3. Publ by IEEE. 1990. p. 1571-1574
Lu, X. M. ; Reid, J. M. ; Soetanto, Kawan ; Weng, L. ; Genis, V. / Cepstrum technique for multilayer structure characterization. Ultrasonics Symposium Proceedings. Vol. 3 Publ by IEEE, 1990. pp. 1571-1574
@inproceedings{b3fbbfc113fb451cba13467c190976d4,
title = "Cepstrum technique for multilayer structure characterization",
abstract = "The triple cepstrum, the third power of the inverse Fourier transform (IFT) of the logarithm of signal power spectrum, is used to characterize two-layer structures. The thickness of each layer can be found from the positions of the peaks in the triple cepstrum. Simulations and preliminary experiments have shown that the relative reflection coefficients can be reconstructed, in the ideal and lossless case, from the polarity and the amplitude of these peaks, as predicted by theory. The impedance pattern can be predicted even at low signal to noise ratio. A potential application of this method is to characterize blood vessel walls. The resulting thickness and impedance pattern could be useful in detecting and classifying plaques, particularly in the early stages.",
author = "Lu, {X. M.} and Reid, {J. M.} and Kawan Soetanto and L. Weng and V. Genis",
year = "1990",
language = "English",
volume = "3",
pages = "1571--1574",
booktitle = "Ultrasonics Symposium Proceedings",
publisher = "Publ by IEEE",

}

TY - GEN

T1 - Cepstrum technique for multilayer structure characterization

AU - Lu, X. M.

AU - Reid, J. M.

AU - Soetanto, Kawan

AU - Weng, L.

AU - Genis, V.

PY - 1990

Y1 - 1990

N2 - The triple cepstrum, the third power of the inverse Fourier transform (IFT) of the logarithm of signal power spectrum, is used to characterize two-layer structures. The thickness of each layer can be found from the positions of the peaks in the triple cepstrum. Simulations and preliminary experiments have shown that the relative reflection coefficients can be reconstructed, in the ideal and lossless case, from the polarity and the amplitude of these peaks, as predicted by theory. The impedance pattern can be predicted even at low signal to noise ratio. A potential application of this method is to characterize blood vessel walls. The resulting thickness and impedance pattern could be useful in detecting and classifying plaques, particularly in the early stages.

AB - The triple cepstrum, the third power of the inverse Fourier transform (IFT) of the logarithm of signal power spectrum, is used to characterize two-layer structures. The thickness of each layer can be found from the positions of the peaks in the triple cepstrum. Simulations and preliminary experiments have shown that the relative reflection coefficients can be reconstructed, in the ideal and lossless case, from the polarity and the amplitude of these peaks, as predicted by theory. The impedance pattern can be predicted even at low signal to noise ratio. A potential application of this method is to characterize blood vessel walls. The resulting thickness and impedance pattern could be useful in detecting and classifying plaques, particularly in the early stages.

UR - http://www.scopus.com/inward/record.url?scp=0025575219&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0025575219&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:0025575219

VL - 3

SP - 1571

EP - 1574

BT - Ultrasonics Symposium Proceedings

PB - Publ by IEEE

ER -