Challenges and prospects for applications in the chips (LSI-Chip optical interconnection)

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	452-457
Number of pages	6
Journal	Journal of Japan Institute of Electronics Packaging
Volume	12
Issue number	5
DOIs	https://doi.org/10.5104/jiep.12.452
Publication status	Published - 2009 Aug
Externally published	Yes

ASJC Scopus subject areas

@article{aff835fd1b6d424aa0bfef400170fedc,

title = "Challenges and prospects for applications in the chips (LSI-Chip optical interconnection)",

author = "Masao Kinoshita and Keishi Ohashi",

year = "2009",

month = aug,

doi = "10.5104/jiep.12.452",

language = "English",

volume = "12",

pages = "452--457",

journal = "Journal of Japan Institute of Electronics Packaging",

issn = "1343-9677",

publisher = "The Japan Institute of Electronics Packaging",

number = "5",

}

TY - JOUR

T1 - Challenges and prospects for applications in the chips (LSI-Chip optical interconnection)

AU - Kinoshita, Masao

AU - Ohashi, Keishi

PY - 2009/8

Y1 - 2009/8

UR - http://www.scopus.com/inward/record.url?scp=84871081335&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84871081335&partnerID=8YFLogxK

U2 - 10.5104/jiep.12.452

DO - 10.5104/jiep.12.452

M3 - Article

AN - SCOPUS:84871081335

VL - 12

SP - 452

EP - 457

JO - Journal of Japan Institute of Electronics Packaging

JF - Journal of Japan Institute of Electronics Packaging

SN - 1343-9677

IS - 5

ER -