Challenges and prospects for applications in the chips (LSI-Chip optical interconnection)

Masao Kinoshita, Keishi Ohashi

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)452-457
Number of pages6
JournalJournal of Japan Institute of Electronics Packaging
Volume12
Issue number5
DOIs
Publication statusPublished - 2009 Aug
Externally publishedYes

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Optical interconnects

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Challenges and prospects for applications in the chips (LSI-Chip optical interconnection). / Kinoshita, Masao; Ohashi, Keishi.

In: Journal of Japan Institute of Electronics Packaging, Vol. 12, No. 5, 08.2009, p. 452-457.

Research output: Contribution to journalArticle

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