Challenges and prospects for applications in the chips (LSI-Chip optical interconnection)

Masao Kinoshita; Keishi Ohashi

doi:10.5104/jiep.12.452

Challenges and prospects for applications in the chips (LSI-Chip optical interconnection)

Masao Kinoshita^*, Keishi Ohashi

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	452-457
Number of pages	6
Journal	Journal of Japan Institute of Electronics Packaging
Volume	12
Issue number	5
DOIs	https://doi.org/10.5104/jiep.12.452
Publication status	Published - 2009 Aug
Externally published	Yes

ASJC Scopus subject areas

Electrical and Electronic Engineering

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title = "Challenges and prospects for applications in the chips (LSI-Chip optical interconnection)",

author = "Masao Kinoshita and Keishi Ohashi",

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journal = "Journal of Japan Institute of Electronics Packaging",

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Challenges and prospects for applications in the chips (LSI-Chip optical interconnection)

ASJC Scopus subject areas

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