| Original language | English |
|---|---|
| Pages (from-to) | 452-457 |
| Number of pages | 6 |
| Journal | Journal of Japan Institute of Electronics Packaging |
| Volume | 12 |
| Issue number | 5 |
| DOIs | |
| Publication status | Published - 2009 Aug |
| Externally published | Yes |
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ASJC Scopus subject areas
- Electrical and Electronic Engineering
Cite this
Challenges and prospects for applications in the chips (LSI-Chip optical interconnection). / Kinoshita, Masao; Ohashi, Keishi.
In: Journal of Japan Institute of Electronics Packaging, Vol. 12, No. 5, 08.2009, p. 452-457.Research output: Contribution to journal › Article
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TY - JOUR
T1 - Challenges and prospects for applications in the chips (LSI-Chip optical interconnection)
AU - Kinoshita, Masao
AU - Ohashi, Keishi
PY - 2009/8
Y1 - 2009/8
UR - http://www.scopus.com/inward/record.url?scp=84871081335&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84871081335&partnerID=8YFLogxK
U2 - 10.5104/jiep.12.452
DO - 10.5104/jiep.12.452
M3 - Article
AN - SCOPUS:84871081335
VL - 12
SP - 452
EP - 457
JO - Journal of Japan Institute of Electronics Packaging
JF - Journal of Japan Institute of Electronics Packaging
SN - 1343-9677
IS - 5
ER -