Challenges and prospects for applications in the chips (LSI-Chip optical interconnection)

Research output: Contribution to journal › Article

Original language	English
Pages (from-to)	452-457
Number of pages	6
Journal	Journal of Japan Institute of Electronics Packaging
Volume	12
Issue number	5
DOIs	https://doi.org/10.5104/jiep.12.452
Publication status	Published - 2009 Aug 1

Cite this

@article{aff835fd1b6d424aa0bfef400170fedc,

title = "Challenges and prospects for applications in the chips (LSI-Chip optical interconnection)",

author = "Masao Kinoshita and Keishi Ohashi",

year = "2009",

month = aug,

day = "1",

doi = "10.5104/jiep.12.452",

language = "English",

volume = "12",

pages = "452--457",

journal = "Journal of Japan Institute of Electronics Packaging",

issn = "1343-9677",

publisher = "The Japan Institute of Electronics Packaging",

number = "5",

}

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AU - Kinoshita, Masao

AU - Ohashi, Keishi

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