Challenges and prospects for applications in the chips (LSI-Chip optical interconnection)

Masao Kinoshita, Keishi Ohashi

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)452-457
Number of pages6
JournalJournal of Japan Institute of Electronics Packaging
Volume12
Issue number5
DOIs
Publication statusPublished - 2009 Aug 1

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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