Characterization of anisotropic strain relaxation after isolation for strained SGOI and SiGe/Si structure with newly developed high-NA and oil-immersion Raman method

Koji Usuda, Tsutomu Tezuka, Daisuke Kosemura, Motohiro Tomita, Atsushi Ogura

Research output: Contribution to journalArticle

9 Citations (Scopus)

Abstract

Local anisotropic strain relaxation at the free edge of the stained SiGe layers after isolation of strained SiGe layers was evaluated using the high-NA and oil-immersion Raman method adopting high numerical aperture (NA:1.4) lens and oil immersion techniques. It was confirmed that forbidden optical phonon mode (TO) can be effectively excited with the technique, and that the anisotropic strain measurement was realized for the strained-SiGe layers. It was found that the strain was more significantly relax in St-SGOI than in St-SiGe around each edge. The result implies that the relaxation mechanism of the SiGe mesas on the SiO2-Box layer and on the Si substrate may be different from each other.

Original languageEnglish
Pages (from-to)46-49
Number of pages4
JournalSolid-State Electronics
Volume83
DOIs
Publication statusPublished - 2013 Jan 1
Externally publishedYes

Keywords

  • Channel
  • MOSFET
  • Raman
  • Relaxation
  • SiGe
  • Strain

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

Fingerprint Dive into the research topics of 'Characterization of anisotropic strain relaxation after isolation for strained SGOI and SiGe/Si structure with newly developed high-NA and oil-immersion Raman method'. Together they form a unique fingerprint.

  • Cite this