Characterization of chemically-deposited NiB and NiWB thin films as a capping layer for ULSI application

Tetsuya Osaka; Nao Takano; Tetsuya Kurokawa; Tomomi Kaneko; Kazuyoshi Ueno

doi:10.1016/S0257-8972(03)00186-5

Characterization of chemically-deposited NiB and NiWB thin films as a capping layer for ULSI application

Tetsuya Osaka, Nao Takano, Tetsuya Kurokawa, Tomomi Kaneko, Kazuyoshi Ueno

Research Organization for Nano & Life Innovation

Research output: Contribution to journal › Article

52 Citations (Scopus)

Abstract

NiB and NiWB films fabricated by electroless deposition were evaluated aiming for the application to a metal cap in the copper interconnects technology. The content of B and W was varied by adjusting the concentration of components in electroless deposition baths in order to clarify the effect of co-deposited element on thermal stability of the films. The thermal stability was evaluated by Auger electron spectroscope, X-ray diffractometer (XRD) and sheet resistance measurement. By measuring the variation in sheet resistance with annealing temperature, it was confirmed that the NiB films showed good thermal stability up to 450 °C, whereas the NiWB films deteriorated at 300 °C. The effect of co-deposited element was discussed based on the results obtained by XRD as well as that of sheet resistance measurement.

Original language	English
Pages (from-to)	124-127
Number of pages	4
Journal	Surface and Coatings Technology
Volume	169-170
DOIs	https://doi.org/10.1016/S0257-8972(03)00186-5
Publication status	Published - 2003 Jun 2

Keywords

Capping layer
Electroless deposition
Ni-B alloy
Thermal stability

ASJC Scopus subject areas

Chemistry(all)
Condensed Matter Physics
Surfaces and Interfaces
Surfaces, Coatings and Films
Materials Chemistry

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Osaka, T., Takano, N., Kurokawa, T., Kaneko, T., & Ueno, K. (2003). Characterization of chemically-deposited NiB and NiWB thin films as a capping layer for ULSI application. Surface and Coatings Technology, 169-170, 124-127. https://doi.org/10.1016/S0257-8972(03)00186-5

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AU - Osaka, Tetsuya

AU - Takano, Nao

AU - Kurokawa, Tetsuya

AU - Kaneko, Tomomi

AU - Ueno, Kazuyoshi

PY - 2003/6/2

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AB - NiB and NiWB films fabricated by electroless deposition were evaluated aiming for the application to a metal cap in the copper interconnects technology. The content of B and W was varied by adjusting the concentration of components in electroless deposition baths in order to clarify the effect of co-deposited element on thermal stability of the films. The thermal stability was evaluated by Auger electron spectroscope, X-ray diffractometer (XRD) and sheet resistance measurement. By measuring the variation in sheet resistance with annealing temperature, it was confirmed that the NiB films showed good thermal stability up to 450 °C, whereas the NiWB films deteriorated at 300 °C. The effect of co-deposited element was discussed based on the results obtained by XRD as well as that of sheet resistance measurement.

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