Characterization of chemically-deposited NiB and NiWB thin films as a capping layer for ULSI application

Tetsuya Osaka, Nao Takano, Tetsuya Kurokawa, Tomomi Kaneko, Kazuyoshi Ueno

Research output: Contribution to journalArticle

51 Citations (Scopus)

Abstract

NiB and NiWB films fabricated by electroless deposition were evaluated aiming for the application to a metal cap in the copper interconnects technology. The content of B and W was varied by adjusting the concentration of components in electroless deposition baths in order to clarify the effect of co-deposited element on thermal stability of the films. The thermal stability was evaluated by Auger electron spectroscope, X-ray diffractometer (XRD) and sheet resistance measurement. By measuring the variation in sheet resistance with annealing temperature, it was confirmed that the NiB films showed good thermal stability up to 450 °C, whereas the NiWB films deteriorated at 300 °C. The effect of co-deposited element was discussed based on the results obtained by XRD as well as that of sheet resistance measurement.

Original languageEnglish
Pages (from-to)124-127
Number of pages4
JournalSurface and Coatings Technology
Volume169-170
DOIs
Publication statusPublished - 2003 Jun 2

Fingerprint

Sheet resistance
electroless deposition
Thin films
Thermodynamic stability
thermal stability
Electroless plating
Diffractometers
thin films
diffractometers
X rays
caps
Copper
baths
x rays
Metals
adjusting
spectrometers
Annealing
copper
annealing

Keywords

  • Capping layer
  • Electroless deposition
  • Ni-B alloy
  • Thermal stability

ASJC Scopus subject areas

  • Surfaces, Coatings and Films
  • Condensed Matter Physics
  • Surfaces and Interfaces

Cite this

Characterization of chemically-deposited NiB and NiWB thin films as a capping layer for ULSI application. / Osaka, Tetsuya; Takano, Nao; Kurokawa, Tetsuya; Kaneko, Tomomi; Ueno, Kazuyoshi.

In: Surface and Coatings Technology, Vol. 169-170, 02.06.2003, p. 124-127.

Research output: Contribution to journalArticle

Osaka, Tetsuya ; Takano, Nao ; Kurokawa, Tetsuya ; Kaneko, Tomomi ; Ueno, Kazuyoshi. / Characterization of chemically-deposited NiB and NiWB thin films as a capping layer for ULSI application. In: Surface and Coatings Technology. 2003 ; Vol. 169-170. pp. 124-127.
@article{b43f1f2eec954bb19e7c3dbe84841702,
title = "Characterization of chemically-deposited NiB and NiWB thin films as a capping layer for ULSI application",
abstract = "NiB and NiWB films fabricated by electroless deposition were evaluated aiming for the application to a metal cap in the copper interconnects technology. The content of B and W was varied by adjusting the concentration of components in electroless deposition baths in order to clarify the effect of co-deposited element on thermal stability of the films. The thermal stability was evaluated by Auger electron spectroscope, X-ray diffractometer (XRD) and sheet resistance measurement. By measuring the variation in sheet resistance with annealing temperature, it was confirmed that the NiB films showed good thermal stability up to 450 °C, whereas the NiWB films deteriorated at 300 °C. The effect of co-deposited element was discussed based on the results obtained by XRD as well as that of sheet resistance measurement.",
keywords = "Capping layer, Electroless deposition, Ni-B alloy, Thermal stability",
author = "Tetsuya Osaka and Nao Takano and Tetsuya Kurokawa and Tomomi Kaneko and Kazuyoshi Ueno",
year = "2003",
month = "6",
day = "2",
doi = "10.1016/S0257-8972(03)00186-5",
language = "English",
volume = "169-170",
pages = "124--127",
journal = "Surface and Coatings Technology",
issn = "0257-8972",
publisher = "Elsevier",

}

TY - JOUR

T1 - Characterization of chemically-deposited NiB and NiWB thin films as a capping layer for ULSI application

AU - Osaka, Tetsuya

AU - Takano, Nao

AU - Kurokawa, Tetsuya

AU - Kaneko, Tomomi

AU - Ueno, Kazuyoshi

PY - 2003/6/2

Y1 - 2003/6/2

N2 - NiB and NiWB films fabricated by electroless deposition were evaluated aiming for the application to a metal cap in the copper interconnects technology. The content of B and W was varied by adjusting the concentration of components in electroless deposition baths in order to clarify the effect of co-deposited element on thermal stability of the films. The thermal stability was evaluated by Auger electron spectroscope, X-ray diffractometer (XRD) and sheet resistance measurement. By measuring the variation in sheet resistance with annealing temperature, it was confirmed that the NiB films showed good thermal stability up to 450 °C, whereas the NiWB films deteriorated at 300 °C. The effect of co-deposited element was discussed based on the results obtained by XRD as well as that of sheet resistance measurement.

AB - NiB and NiWB films fabricated by electroless deposition were evaluated aiming for the application to a metal cap in the copper interconnects technology. The content of B and W was varied by adjusting the concentration of components in electroless deposition baths in order to clarify the effect of co-deposited element on thermal stability of the films. The thermal stability was evaluated by Auger electron spectroscope, X-ray diffractometer (XRD) and sheet resistance measurement. By measuring the variation in sheet resistance with annealing temperature, it was confirmed that the NiB films showed good thermal stability up to 450 °C, whereas the NiWB films deteriorated at 300 °C. The effect of co-deposited element was discussed based on the results obtained by XRD as well as that of sheet resistance measurement.

KW - Capping layer

KW - Electroless deposition

KW - Ni-B alloy

KW - Thermal stability

UR - http://www.scopus.com/inward/record.url?scp=0038807762&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0038807762&partnerID=8YFLogxK

U2 - 10.1016/S0257-8972(03)00186-5

DO - 10.1016/S0257-8972(03)00186-5

M3 - Article

AN - SCOPUS:0038807762

VL - 169-170

SP - 124

EP - 127

JO - Surface and Coatings Technology

JF - Surface and Coatings Technology

SN - 0257-8972

ER -