Abstract
NiB and NiWB films fabricated by electroless deposition were evaluated aiming for the application to a metal cap in the copper interconnects technology. The content of B and W was varied by adjusting the concentration of components in electroless deposition baths in order to clarify the effect of co-deposited element on thermal stability of the films. The thermal stability was evaluated by Auger electron spectroscope, X-ray diffractometer (XRD) and sheet resistance measurement. By measuring the variation in sheet resistance with annealing temperature, it was confirmed that the NiB films showed good thermal stability up to 450 °C, whereas the NiWB films deteriorated at 300 °C. The effect of co-deposited element was discussed based on the results obtained by XRD as well as that of sheet resistance measurement.
| Original language | English |
|---|---|
| Pages (from-to) | 124-127 |
| Number of pages | 4 |
| Journal | Surface and Coatings Technology |
| Volume | 169-170 |
| DOIs | |
| Publication status | Published - 2003 Jun 2 |
Fingerprint
Keywords
- Capping layer
- Electroless deposition
- Ni-B alloy
- Thermal stability
ASJC Scopus subject areas
- Surfaces, Coatings and Films
- Condensed Matter Physics
- Surfaces and Interfaces
Cite this
Characterization of chemically-deposited NiB and NiWB thin films as a capping layer for ULSI application. / Osaka, Tetsuya; Takano, Nao; Kurokawa, Tetsuya; Kaneko, Tomomi; Ueno, Kazuyoshi.
In: Surface and Coatings Technology, Vol. 169-170, 02.06.2003, p. 124-127.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Characterization of chemically-deposited NiB and NiWB thin films as a capping layer for ULSI application
AU - Osaka, Tetsuya
AU - Takano, Nao
AU - Kurokawa, Tetsuya
AU - Kaneko, Tomomi
AU - Ueno, Kazuyoshi
PY - 2003/6/2
Y1 - 2003/6/2
N2 - NiB and NiWB films fabricated by electroless deposition were evaluated aiming for the application to a metal cap in the copper interconnects technology. The content of B and W was varied by adjusting the concentration of components in electroless deposition baths in order to clarify the effect of co-deposited element on thermal stability of the films. The thermal stability was evaluated by Auger electron spectroscope, X-ray diffractometer (XRD) and sheet resistance measurement. By measuring the variation in sheet resistance with annealing temperature, it was confirmed that the NiB films showed good thermal stability up to 450 °C, whereas the NiWB films deteriorated at 300 °C. The effect of co-deposited element was discussed based on the results obtained by XRD as well as that of sheet resistance measurement.
AB - NiB and NiWB films fabricated by electroless deposition were evaluated aiming for the application to a metal cap in the copper interconnects technology. The content of B and W was varied by adjusting the concentration of components in electroless deposition baths in order to clarify the effect of co-deposited element on thermal stability of the films. The thermal stability was evaluated by Auger electron spectroscope, X-ray diffractometer (XRD) and sheet resistance measurement. By measuring the variation in sheet resistance with annealing temperature, it was confirmed that the NiB films showed good thermal stability up to 450 °C, whereas the NiWB films deteriorated at 300 °C. The effect of co-deposited element was discussed based on the results obtained by XRD as well as that of sheet resistance measurement.
KW - Capping layer
KW - Electroless deposition
KW - Ni-B alloy
KW - Thermal stability
UR - http://www.scopus.com/inward/record.url?scp=0038807762&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=0038807762&partnerID=8YFLogxK
U2 - 10.1016/S0257-8972(03)00186-5
DO - 10.1016/S0257-8972(03)00186-5
M3 - Article
AN - SCOPUS:0038807762
VL - 169-170
SP - 124
EP - 127
JO - Surface and Coatings Technology
JF - Surface and Coatings Technology
SN - 0257-8972
ER -