Characterization of low temperature bonding with Cu nanoparticles for electronic packaging application

Jianfeng Yan, Guisheng Zou, Xiaoyu Wang, Fengwen Mu, Hailin Bai, Aiping Wu, Anming Hu, Y. Norman Zhou

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Tin-lead alloys are widely used as solder in the electronics industry. For concerns of environment and human health, it is necessary to develop new bonding method using Pb-free material for microelectronic packaging. There have been some reports about low temperature bonding using Ag nanoparticles. Compared with Ag nanoparticles, Cu nanoparticles have some advantages, such as low cost and good ionic migration property. In this study we report a low temperature bonding process using Cu nanoparticles. The polymer coated on the surface of Cu nanoparticles can protect them from oxidation. Strong joints were formed at bonding temperatures as low as 180°C under 5MPa in air atmosphere. This novel sintering-bonding technology using Cu nanoparticles as interconnection material has a potential application for electronic packaging.

Original languageEnglish
Title of host publicationMaterials Science and Technology Conference and Exhibition 2011, MS and T'11
Pages1526-1531
Number of pages6
Publication statusPublished - 2011 Dec 1
Externally publishedYes
EventMaterials Science and Technology Conference and Exhibition 2011, MS and T'11 - Columbus, OH, United States
Duration: 2011 Oct 162011 Oct 20

Publication series

NameMaterials Science and Technology Conference and Exhibition 2011, MS and T'11
Volume2

Conference

ConferenceMaterials Science and Technology Conference and Exhibition 2011, MS and T'11
CountryUnited States
CityColumbus, OH
Period11/10/1611/10/20

Keywords

  • Bonding
  • Cu nanoparticles
  • Electronic packaging
  • Sintering

ASJC Scopus subject areas

  • Materials Science(all)

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  • Cite this

    Yan, J., Zou, G., Wang, X., Mu, F., Bai, H., Wu, A., Hu, A., & Zhou, Y. N. (2011). Characterization of low temperature bonding with Cu nanoparticles for electronic packaging application. In Materials Science and Technology Conference and Exhibition 2011, MS and T'11 (pp. 1526-1531). (Materials Science and Technology Conference and Exhibition 2011, MS and T'11; Vol. 2).