Characterization of low temperature bonding with Cu nanoparticles for electronic packaging application

Jianfeng Yan, Guisheng Zou, Xiaoyu Wang, Fengwen Mu, Hailin Bai, Aiping Wu, Anming Hu, Y. Norman Zhou

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

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Chemical Compounds

Engineering & Materials Science