Characterizing temporary bonding adhesives using a wedge test

L. Yan, Takeo Suga, S. M. June, Timothy Edward Long, D. A. Dillard

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Reversible adhesion has long been of significant practical interest for a range of applications including controllable adhesion, photolithography, temporary bonding required for wound dressings and certain manufacturing processes, and disassembly for repairing and recycling. UV degradable materials find applications in medical and microelectronic fields due to their dramatic property changes after UV irradiation, allow for easy removal of the adhesive. A series of UV cleavable adhesives has been synthesized to investigate their ability to debond more readily as a function of UV radiation dosage. In this paper a wedge test, from elevated temperature exposure or photo-degradation, is used to measure the reduction in resistance to debonding. By using fracture mechanics principles and recording the growing debond length as a function of exposure, the fracture energy can be determined. Tests are conducted to measure how fracture energy decreases after varying amounts of thermal exposure or UV irradiation. The debond surfaces and locus of failure are also investigated in this study.

Original languageEnglish
Title of host publication12th International Conference on Fracture 2009, ICF-12
Pages6347-6355
Number of pages9
Volume8
Publication statusPublished - 2009
Externally publishedYes
Event12th International Conference on Fracture 2009, ICF-12 - Ottawa, ON
Duration: 2009 Jul 122009 Jul 17

Other

Other12th International Conference on Fracture 2009, ICF-12
CityOttawa, ON
Period09/7/1209/7/17

Fingerprint

Fracture energy
Adhesives
Adhesion
Irradiation
adhesion
Photodegradation
Debonding
irradiation
Photolithography
Fracture mechanics
Microelectronics
Ultraviolet radiation
Recycling
fracture mechanics
photodegradation
energy
manufacturing
recycling
Temperature
adhesive

ASJC Scopus subject areas

  • Geotechnical Engineering and Engineering Geology

Cite this

Yan, L., Suga, T., June, S. M., Long, T. E., & Dillard, D. A. (2009). Characterizing temporary bonding adhesives using a wedge test. In 12th International Conference on Fracture 2009, ICF-12 (Vol. 8, pp. 6347-6355)

Characterizing temporary bonding adhesives using a wedge test. / Yan, L.; Suga, Takeo; June, S. M.; Long, Timothy Edward; Dillard, D. A.

12th International Conference on Fracture 2009, ICF-12. Vol. 8 2009. p. 6347-6355.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Yan, L, Suga, T, June, SM, Long, TE & Dillard, DA 2009, Characterizing temporary bonding adhesives using a wedge test. in 12th International Conference on Fracture 2009, ICF-12. vol. 8, pp. 6347-6355, 12th International Conference on Fracture 2009, ICF-12, Ottawa, ON, 09/7/12.
Yan L, Suga T, June SM, Long TE, Dillard DA. Characterizing temporary bonding adhesives using a wedge test. In 12th International Conference on Fracture 2009, ICF-12. Vol. 8. 2009. p. 6347-6355
Yan, L. ; Suga, Takeo ; June, S. M. ; Long, Timothy Edward ; Dillard, D. A. / Characterizing temporary bonding adhesives using a wedge test. 12th International Conference on Fracture 2009, ICF-12. Vol. 8 2009. pp. 6347-6355
@inproceedings{0875af9cad834b2a9438ebe2fb0ef823,
title = "Characterizing temporary bonding adhesives using a wedge test",
abstract = "Reversible adhesion has long been of significant practical interest for a range of applications including controllable adhesion, photolithography, temporary bonding required for wound dressings and certain manufacturing processes, and disassembly for repairing and recycling. UV degradable materials find applications in medical and microelectronic fields due to their dramatic property changes after UV irradiation, allow for easy removal of the adhesive. A series of UV cleavable adhesives has been synthesized to investigate their ability to debond more readily as a function of UV radiation dosage. In this paper a wedge test, from elevated temperature exposure or photo-degradation, is used to measure the reduction in resistance to debonding. By using fracture mechanics principles and recording the growing debond length as a function of exposure, the fracture energy can be determined. Tests are conducted to measure how fracture energy decreases after varying amounts of thermal exposure or UV irradiation. The debond surfaces and locus of failure are also investigated in this study.",
author = "L. Yan and Takeo Suga and June, {S. M.} and Long, {Timothy Edward} and Dillard, {D. A.}",
year = "2009",
language = "English",
isbn = "9781617382277",
volume = "8",
pages = "6347--6355",
booktitle = "12th International Conference on Fracture 2009, ICF-12",

}

TY - GEN

T1 - Characterizing temporary bonding adhesives using a wedge test

AU - Yan, L.

AU - Suga, Takeo

AU - June, S. M.

AU - Long, Timothy Edward

AU - Dillard, D. A.

PY - 2009

Y1 - 2009

N2 - Reversible adhesion has long been of significant practical interest for a range of applications including controllable adhesion, photolithography, temporary bonding required for wound dressings and certain manufacturing processes, and disassembly for repairing and recycling. UV degradable materials find applications in medical and microelectronic fields due to their dramatic property changes after UV irradiation, allow for easy removal of the adhesive. A series of UV cleavable adhesives has been synthesized to investigate their ability to debond more readily as a function of UV radiation dosage. In this paper a wedge test, from elevated temperature exposure or photo-degradation, is used to measure the reduction in resistance to debonding. By using fracture mechanics principles and recording the growing debond length as a function of exposure, the fracture energy can be determined. Tests are conducted to measure how fracture energy decreases after varying amounts of thermal exposure or UV irradiation. The debond surfaces and locus of failure are also investigated in this study.

AB - Reversible adhesion has long been of significant practical interest for a range of applications including controllable adhesion, photolithography, temporary bonding required for wound dressings and certain manufacturing processes, and disassembly for repairing and recycling. UV degradable materials find applications in medical and microelectronic fields due to their dramatic property changes after UV irradiation, allow for easy removal of the adhesive. A series of UV cleavable adhesives has been synthesized to investigate their ability to debond more readily as a function of UV radiation dosage. In this paper a wedge test, from elevated temperature exposure or photo-degradation, is used to measure the reduction in resistance to debonding. By using fracture mechanics principles and recording the growing debond length as a function of exposure, the fracture energy can be determined. Tests are conducted to measure how fracture energy decreases after varying amounts of thermal exposure or UV irradiation. The debond surfaces and locus of failure are also investigated in this study.

UR - http://www.scopus.com/inward/record.url?scp=84869787969&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84869787969&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:84869787969

SN - 9781617382277

VL - 8

SP - 6347

EP - 6355

BT - 12th International Conference on Fracture 2009, ICF-12

ER -