Chemical flip-chip bonding method for fabricating 10-μm-pad-pitch interconnect

Yasuhiro Yamaji*, Tokihiko Yokoshima, Katsuya Kikuchi, Hiroshi Nakagawa, Masahiro Aoyagi

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

4 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Chemical flip-chip bonding method for fabricating 10-μm-pad-pitch interconnect'. Together they form a unique fingerprint.

Physics & Astronomy

Engineering & Materials Science