Chromium and iridium effects on the short-term interdiffusion behaviour between Pt rich γ-γ′ bond-coatings and a Ni-Al-Cr alloy

Pauline Audigié, Aurélie Rouaix-Vande Put, Hideyuki Murakami, Daniel Monceau

Research output: Contribution to journalArticle

4 Citations (Scopus)

Abstract

The interdiffusion behaviour of a 5 μm thick layer of Pt deposited by electroplating on a γ-Ni-12Al-10Cr model alloy was studied in order to assess the effect of Cr. Heat treatments were performed for 1 min up to 1 h at 1100 °C under argon. Cr addition increased the uphill diffusion of Al to the surface when compared with Pt/γ-(Ni,Al) systems. Al and Cr had a positive chemical interaction in presence of Pt, as shown by the positive values of the DAlCrNi and DCrAlNi diffusion coefficients determined by modelling. Pt had a negative chemical interaction with Al and with Cr in such a way that Pt decreased their activities. According to the diffusion coefficient values, Pt had a greater influence on the Al activity than on the Cr one. Similarly, 2 μm of Pt and 3 μm of Pt-25Ir were deposited by electroplating on the same model alloy to investigate the effect of Ir. Heat treatments were performed in the same conditions as for Cr. Iridium slowed down the interdiffusion when compared with systems with Pt only. Iridium diffused slower toward the substrate than Pt and a lower Pt + Ir flux toward the substrate was found. As voids formed at the interdiffusion zone/substrate interface due to Kirkendall effect, this lower inward Pt + Ir flux resulted in a lower outward vacancy flux and then Ir reduced Kirkendall voids formation. Moreover, Ir decreased the Pt effect on Al activity by dilution or even gave an opposite contribution to the Pt one. This reduced the uphill diffusion of Al, delaying the α-NiPtAl phase formation. Diffusion paths of each model system were also identified after 15 min at 1100 °C and all highlighted the α-NiPtAl phase formation and its aptitude to be used in TBC systems.

Original languageEnglish
Pages (from-to)258-265
Number of pages8
JournalSurface and Coatings Technology
Volume309
DOIs
Publication statusPublished - 2017 Jan 15
Externally publishedYes

Fingerprint

Iridium
Chromium
iridium
chromium
electroplating
coatings
Coatings
voids
heat treatment
diffusion coefficient
aptitude
Kirkendall effect
Electroplating
Fluxes
Substrates
Heat treatment
dilution
Interdiffusion (solids)
argon
interactions

Keywords

  • Bond-coatings
  • Interdiffusion modelling
  • Iridium
  • Ni-Al-Cr alloys
  • Platinum

ASJC Scopus subject areas

  • Chemistry(all)
  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Materials Chemistry

Cite this

Chromium and iridium effects on the short-term interdiffusion behaviour between Pt rich γ-γ′ bond-coatings and a Ni-Al-Cr alloy. / Audigié, Pauline; Rouaix-Vande Put, Aurélie; Murakami, Hideyuki; Monceau, Daniel.

In: Surface and Coatings Technology, Vol. 309, 15.01.2017, p. 258-265.

Research output: Contribution to journalArticle

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abstract = "The interdiffusion behaviour of a 5 μm thick layer of Pt deposited by electroplating on a γ-Ni-12Al-10Cr model alloy was studied in order to assess the effect of Cr. Heat treatments were performed for 1 min up to 1 h at 1100 °C under argon. Cr addition increased the uphill diffusion of Al to the surface when compared with Pt/γ-(Ni,Al) systems. Al and Cr had a positive chemical interaction in presence of Pt, as shown by the positive values of the DAlCrNi and DCrAlNi diffusion coefficients determined by modelling. Pt had a negative chemical interaction with Al and with Cr in such a way that Pt decreased their activities. According to the diffusion coefficient values, Pt had a greater influence on the Al activity than on the Cr one. Similarly, 2 μm of Pt and 3 μm of Pt-25Ir were deposited by electroplating on the same model alloy to investigate the effect of Ir. Heat treatments were performed in the same conditions as for Cr. Iridium slowed down the interdiffusion when compared with systems with Pt only. Iridium diffused slower toward the substrate than Pt and a lower Pt + Ir flux toward the substrate was found. As voids formed at the interdiffusion zone/substrate interface due to Kirkendall effect, this lower inward Pt + Ir flux resulted in a lower outward vacancy flux and then Ir reduced Kirkendall voids formation. Moreover, Ir decreased the Pt effect on Al activity by dilution or even gave an opposite contribution to the Pt one. This reduced the uphill diffusion of Al, delaying the α-NiPtAl phase formation. Diffusion paths of each model system were also identified after 15 min at 1100 °C and all highlighted the α-NiPtAl phase formation and its aptitude to be used in TBC systems.",
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AU - Monceau, Daniel

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