Compact flip-chip interconnection 112-Gbit/s EADFB laser array module with high eye-mask margin

Shigeru Kanazawa, Takeshi Fujisawa, Nobuhiro Nunoya, Akira Ohki, Kiyoto Takahata, Hiroaki Sanjoh, Ryuzo Iga, Hiroyuki Ishii

Research output: Contribution to journalArticle

12 Citations (Scopus)

Abstract

The first compact and high-performance optical transmitter using flip-chip interconnects has been developed for a 112-Gbit/s transceiver. The flip-chip interconnects provide lower crosstalk and a higher modulation bandwidth than wire interconnects. The flip-chip interconnection module has 3-dB frequency bandwidths of over 30 GHz. This value is up to 5 GHz better than that of a wire interconnection module. Under four-channel simultaneous operation, the OTU4 mask margins for all four lanes of the flip-chip interconnection module exceed 37%. These values are degraded up to only 4% compared with those for single-channel operation. In addition, an error-free transmission through 10 km of single-mode fiber at 112 Gbit/s is demonstrated.

Original languageEnglish
Article number6664988
Pages (from-to)115-121
Number of pages7
JournalJournal of Lightwave Technology
Volume32
Issue number1
DOIs
Publication statusPublished - 2014 Jan 1
Externally publishedYes

Fingerprint

laser arrays
margins
masks
modules
chips
wire
bandwidth
transmitter receivers
crosstalk
transmitters
modulation
fibers

Keywords

  • 100 Gbit ethernet
  • Distributed feedback laser
  • EADFB laser array
  • Electro-absorption modulator
  • Flip-chip interconnection
  • In-GaAlAs
  • OTU4
  • Photonic integrated circuits

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics

Cite this

Compact flip-chip interconnection 112-Gbit/s EADFB laser array module with high eye-mask margin. / Kanazawa, Shigeru; Fujisawa, Takeshi; Nunoya, Nobuhiro; Ohki, Akira; Takahata, Kiyoto; Sanjoh, Hiroaki; Iga, Ryuzo; Ishii, Hiroyuki.

In: Journal of Lightwave Technology, Vol. 32, No. 1, 6664988, 01.01.2014, p. 115-121.

Research output: Contribution to journalArticle

Kanazawa, S, Fujisawa, T, Nunoya, N, Ohki, A, Takahata, K, Sanjoh, H, Iga, R & Ishii, H 2014, 'Compact flip-chip interconnection 112-Gbit/s EADFB laser array module with high eye-mask margin', Journal of Lightwave Technology, vol. 32, no. 1, 6664988, pp. 115-121. https://doi.org/10.1109/JLT.2013.2291034
Kanazawa, Shigeru ; Fujisawa, Takeshi ; Nunoya, Nobuhiro ; Ohki, Akira ; Takahata, Kiyoto ; Sanjoh, Hiroaki ; Iga, Ryuzo ; Ishii, Hiroyuki. / Compact flip-chip interconnection 112-Gbit/s EADFB laser array module with high eye-mask margin. In: Journal of Lightwave Technology. 2014 ; Vol. 32, No. 1. pp. 115-121.
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