Compact flip-chip interconnection 8 × 50 Gbit/s EADFB laser array module for 400 Gbit/s transceiver

S. Kanazawa, T. Fujisawa, A. Ohki, K. Takahata, H. Sanjoh, R. Iga, H. Ishii

Research output: Contribution to journalArticle

14 Citations (Scopus)

Abstract

The first compact electroabsorption modulators integrated with distributed-feedback (EADFB) laser array module using flip-chip interconnects have been fabricated for a 400 Gbit/s transceiver. Eight 50 Gbit/s EADFB lasers and an optical multiplexer were monolithically integrated on one chip in an area of only 3.2 × 4.8 mm. The flip-chip interconnects provide a higher modulation bandwidth. Clear eye opening was achieved for all eight lanes under 50 Gbit/s operation.

Original languageEnglish
Pages (from-to)533-534
Number of pages2
JournalElectronics Letters
Volume50
Issue number7
DOIs
Publication statusPublished - 2014 Mar 27

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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