Compact flip-chip interconnection 8 × 50 Gbit/s EADFB laser array module for 400 Gbit/s transceiver

S. Kanazawa, T. Fujisawa, A. Ohki, Kiyoto Takahata, H. Sanjoh, R. Iga, H. Ishii

Research output: Contribution to journalArticle

14 Citations (Scopus)

Abstract

The first compact electroabsorption modulators integrated with distributed-feedback (EADFB) laser array module using flip-chip interconnects have been fabricated for a 400 Gbit/s transceiver. Eight 50 Gbit/s EADFB lasers and an optical multiplexer were monolithically integrated on one chip in an area of only 3.2 × 4.8 mm. The flip-chip interconnects provide a higher modulation bandwidth. Clear eye opening was achieved for all eight lanes under 50 Gbit/s operation.

Original languageEnglish
Pages (from-to)533-534
Number of pages2
JournalElectronics Letters
Volume50
Issue number7
DOIs
Publication statusPublished - 2014 Mar 27
Externally publishedYes

Fingerprint

Electroabsorption modulators
Distributed feedback lasers
Transceivers
Modulation
Bandwidth
Lasers

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Compact flip-chip interconnection 8 × 50 Gbit/s EADFB laser array module for 400 Gbit/s transceiver. / Kanazawa, S.; Fujisawa, T.; Ohki, A.; Takahata, Kiyoto; Sanjoh, H.; Iga, R.; Ishii, H.

In: Electronics Letters, Vol. 50, No. 7, 27.03.2014, p. 533-534.

Research output: Contribution to journalArticle

Kanazawa, S. ; Fujisawa, T. ; Ohki, A. ; Takahata, Kiyoto ; Sanjoh, H. ; Iga, R. ; Ishii, H. / Compact flip-chip interconnection 8 × 50 Gbit/s EADFB laser array module for 400 Gbit/s transceiver. In: Electronics Letters. 2014 ; Vol. 50, No. 7. pp. 533-534.
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