Comparative studies on solder joint reliability of CTBGA assemblies with various adhesives using the array-based package shear test

Hongbin Shi, Toshitsugu Ueda

    Research output: Contribution to journalArticle

    12 Citations (Scopus)

    Abstract

    This paper discusses the influences of various adhesives on board-level shear strength of ChipArray®; Thin Core Ball Grid Array (CTBGA) assemblies through an innovative reliability evaluation approach, i.e. array-based package (ABP) shear test. It is found that the adhesives do enhance the shear strength for all the test categories as compared with the assemblies without adhesives (w/o A), but the degree of improvements between different strategies vary quiet a lot. The specific shear strength is affected by a number of factors, in which dispending patterns and material properties of the adhesives used influences it obviously. In general, the adhesives with high storage modulus and large dispensing volume are preferred, for example, stiff full or partial capillary flow underfills. In order to further understand the failure mechanism of the CTBGA during the ABP shear test, failure analysis on tested devices are also conducted using side view optical microscopy, scanning electron microscope (SEM) and energy dispersive X-ray (EDX), the results indicate that the predominant failure mode changes from PCB pad lift/cratering to fracture at package side intermetallic compound (IMC)/solder interface with increasing dispensing volume and storage modulus, which basically improves the solder joint reliability of CTBGA assemblies.

    Original languageEnglish
    Pages (from-to)1898-1902
    Number of pages5
    JournalMicroelectronics Reliability
    Volume51
    Issue number9-11
    DOIs
    Publication statusPublished - 2011 Sep

    Fingerprint

    solders
    Soldering alloys
    adhesives
    assemblies
    Adhesives
    shear
    shear strength
    Shear strength
    Elastic moduli
    capillary flow
    Capillary flow
    cratering
    Ball grid arrays
    failure analysis
    polychlorinated biphenyls
    Polychlorinated Biphenyls
    failure modes
    Polychlorinated biphenyls
    Failure modes
    Intermetallics

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering
    • Electronic, Optical and Magnetic Materials
    • Surfaces, Coatings and Films
    • Atomic and Molecular Physics, and Optics
    • Condensed Matter Physics
    • Safety, Risk, Reliability and Quality

    Cite this

    Comparative studies on solder joint reliability of CTBGA assemblies with various adhesives using the array-based package shear test. / Shi, Hongbin; Ueda, Toshitsugu.

    In: Microelectronics Reliability, Vol. 51, No. 9-11, 09.2011, p. 1898-1902.

    Research output: Contribution to journalArticle

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