Comparative studies on solder joint reliability of CTBGA assemblies with various adhesives using the array-based package shear test

Hongbin Shi, Toshitsugu Ueda

    Research output: Contribution to journalArticlepeer-review

    12 Citations (Scopus)

    Fingerprint Dive into the research topics of 'Comparative studies on solder joint reliability of CTBGA assemblies with various adhesives using the array-based package shear test'. Together they form a unique fingerprint.

    Physics & Astronomy

    Chemical Compounds

    Engineering & Materials Science