Comparison of dielectric properties among polydicyclopentadiene resin, epoxy resin and their composites with microsized SiO2 fillers

Yuki Masuzaki, Yoshimichi Ohki, Masahiro Kozako

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    12 Citations (Scopus)

    Abstract

    Complex permittivity spectra of polydicyclopenta-diene resin and epoxy resin, and their composites with SiO2 microfiller were obtained in a wide temperature and frequency range. Both εr′ and εr″ at high temperatures above their glass transition temperatures (Tg's) are much lower in polydicyclopentadiene resin than in epoxy resin, even though the two Tg's are almost the same. Furthermore, analysis using electric modulus has revealed that addition of the microfiller in epoxy resin suppresses dipolar orientation and charge transport. However, both the dipolar orientation and charge transport seem to be difficult in polydicyclopentadien resin and its composite compared to epoxy resin and its composite.

    Original languageEnglish
    Title of host publicationProceedings of the International Symposium on Electrical Insulating Materials
    PublisherInstitute of Electrical Engineers of Japan
    Pages374-377
    Number of pages4
    ISBN (Print)9784886860866
    DOIs
    Publication statusPublished - 2014
    Event2014 International Symposium on Electrical Insulating Materials, ISEIM 2014 - Niigata
    Duration: 2014 Jun 12014 Jun 5

    Other

    Other2014 International Symposium on Electrical Insulating Materials, ISEIM 2014
    CityNiigata
    Period14/6/114/6/5

    Fingerprint

    Epoxy Resins
    Epoxy resins
    Dielectric properties
    Fillers
    Resins
    Composite materials
    Charge transfer
    Composite Resins
    Permittivity
    Temperature

    Keywords

    • complex permittivity
    • composite
    • dielectric relaxation
    • electric modulus
    • epoxy resin
    • polydicyclopentadiene resin

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering
    • Electronic, Optical and Magnetic Materials

    Cite this

    Masuzaki, Y., Ohki, Y., & Kozako, M. (2014). Comparison of dielectric properties among polydicyclopentadiene resin, epoxy resin and their composites with microsized SiO2 fillers. In Proceedings of the International Symposium on Electrical Insulating Materials (pp. 374-377). [6870797] Institute of Electrical Engineers of Japan. https://doi.org/10.1109/ISEIM.2014.6870797

    Comparison of dielectric properties among polydicyclopentadiene resin, epoxy resin and their composites with microsized SiO2 fillers. / Masuzaki, Yuki; Ohki, Yoshimichi; Kozako, Masahiro.

    Proceedings of the International Symposium on Electrical Insulating Materials. Institute of Electrical Engineers of Japan, 2014. p. 374-377 6870797.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Masuzaki, Y, Ohki, Y & Kozako, M 2014, Comparison of dielectric properties among polydicyclopentadiene resin, epoxy resin and their composites with microsized SiO2 fillers. in Proceedings of the International Symposium on Electrical Insulating Materials., 6870797, Institute of Electrical Engineers of Japan, pp. 374-377, 2014 International Symposium on Electrical Insulating Materials, ISEIM 2014, Niigata, 14/6/1. https://doi.org/10.1109/ISEIM.2014.6870797
    Masuzaki Y, Ohki Y, Kozako M. Comparison of dielectric properties among polydicyclopentadiene resin, epoxy resin and their composites with microsized SiO2 fillers. In Proceedings of the International Symposium on Electrical Insulating Materials. Institute of Electrical Engineers of Japan. 2014. p. 374-377. 6870797 https://doi.org/10.1109/ISEIM.2014.6870797
    Masuzaki, Yuki ; Ohki, Yoshimichi ; Kozako, Masahiro. / Comparison of dielectric properties among polydicyclopentadiene resin, epoxy resin and their composites with microsized SiO2 fillers. Proceedings of the International Symposium on Electrical Insulating Materials. Institute of Electrical Engineers of Japan, 2014. pp. 374-377
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