Comparison of dielectric properties among polydicyclopentadiene resin, epoxy resin and their composites with microsized SiO2 fillers

Yuki Masuzaki, Yoshimichi Ohki, Masahiro Kozako

Research output: Chapter in Book/Report/Conference proceedingConference contribution

13 Citations (Scopus)

Abstract

Complex permittivity spectra of polydicyclopenta-diene resin and epoxy resin, and their composites with SiO2 microfiller were obtained in a wide temperature and frequency range. Both εr′ and εr″ at high temperatures above their glass transition temperatures (Tg's) are much lower in polydicyclopentadiene resin than in epoxy resin, even though the two Tg's are almost the same. Furthermore, analysis using electric modulus has revealed that addition of the microfiller in epoxy resin suppresses dipolar orientation and charge transport. However, both the dipolar orientation and charge transport seem to be difficult in polydicyclopentadien resin and its composite compared to epoxy resin and its composite.

Original languageEnglish
Title of host publicationProceedings of 2014 International Symposium on Electrical Insulating Materials, ISEIM 2014
PublisherInstitute of Electrical Engineers of Japan
Pages374-377
Number of pages4
ISBN (Print)9784886860866
DOIs
Publication statusPublished - 2014 Jan 1
Event2014 International Symposium on Electrical Insulating Materials, ISEIM 2014 - Niigata, Japan
Duration: 2014 Jun 12014 Jun 5

Publication series

NameProceedings of the International Symposium on Electrical Insulating Materials

Other

Other2014 International Symposium on Electrical Insulating Materials, ISEIM 2014
CountryJapan
CityNiigata
Period14/6/114/6/5

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Keywords

  • complex permittivity
  • composite
  • dielectric relaxation
  • electric modulus
  • epoxy resin
  • polydicyclopentadiene resin

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Masuzaki, Y., Ohki, Y., & Kozako, M. (2014). Comparison of dielectric properties among polydicyclopentadiene resin, epoxy resin and their composites with microsized SiO2 fillers. In Proceedings of 2014 International Symposium on Electrical Insulating Materials, ISEIM 2014 (pp. 374-377). [6870797] (Proceedings of the International Symposium on Electrical Insulating Materials). Institute of Electrical Engineers of Japan. https://doi.org/10.1109/ISEIM.2014.6870797