Comparison of dielectric properties of low-density polyethylene/MgO composites with different size fillers

K. Ishimoto, T. Tanaka, Yoshimichi Ohki, Y. Sekiguchi, Y. Murata, M. Gosyowaki

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    19 Citations (Scopus)

    Abstract

    Two kinds of low-density polyethylene (LDPE) composites were prepared by adding semi-spherical MgO fillers different in diameter, one being around several ten nra and the other being several um, and their dielectric properties were compared. At all the measurement temperatures, the conductivity is decreased and the permittivity is increased by the addition of fillers, irrespective of their sizes. However, the conductivity decrease is more significant and the permittivity increase is suppressed more in the case of the nm fillers. In addition, a drastic increase in dielectric loss factor at low frequencies is suppressed more significantly by the addition of the nm fillers. While the formation of packet-like charge observed in LDPE, which is assumed to appear at the front of the high-conductivity region that proceeds from one electrode toward the counter one, is suppressed significantly by both fillers, the effect is more significant in the nanocomposites. This means that the nanofillers suppress the increase in conductivity induced by the voltage application more effectively.

    Original languageEnglish
    Title of host publicationAnnual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP
    Pages208-211
    Number of pages4
    DOIs
    Publication statusPublished - 2008
    Event2008 Annual Report Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2008 - Quebec City, QC
    Duration: 2008 Oct 262008 Oct 29

    Other

    Other2008 Annual Report Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2008
    CityQuebec City, QC
    Period08/10/2608/10/29

    Fingerprint

    Low density polyethylenes
    Polyethylene
    Dielectric properties
    Fillers
    Composite materials
    Permittivity
    Dielectric losses
    Temperature measurement
    Nanocomposites
    Electrodes
    Electric potential

    ASJC Scopus subject areas

    • Electronic, Optical and Magnetic Materials
    • Electrical and Electronic Engineering

    Cite this

    Ishimoto, K., Tanaka, T., Ohki, Y., Sekiguchi, Y., Murata, Y., & Gosyowaki, M. (2008). Comparison of dielectric properties of low-density polyethylene/MgO composites with different size fillers. In Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP (pp. 208-211). [4772819] https://doi.org/10.1109/CEIDP.2008.4772819

    Comparison of dielectric properties of low-density polyethylene/MgO composites with different size fillers. / Ishimoto, K.; Tanaka, T.; Ohki, Yoshimichi; Sekiguchi, Y.; Murata, Y.; Gosyowaki, M.

    Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP. 2008. p. 208-211 4772819.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Ishimoto, K, Tanaka, T, Ohki, Y, Sekiguchi, Y, Murata, Y & Gosyowaki, M 2008, Comparison of dielectric properties of low-density polyethylene/MgO composites with different size fillers. in Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP., 4772819, pp. 208-211, 2008 Annual Report Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2008, Quebec City, QC, 08/10/26. https://doi.org/10.1109/CEIDP.2008.4772819
    Ishimoto K, Tanaka T, Ohki Y, Sekiguchi Y, Murata Y, Gosyowaki M. Comparison of dielectric properties of low-density polyethylene/MgO composites with different size fillers. In Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP. 2008. p. 208-211. 4772819 https://doi.org/10.1109/CEIDP.2008.4772819
    Ishimoto, K. ; Tanaka, T. ; Ohki, Yoshimichi ; Sekiguchi, Y. ; Murata, Y. ; Gosyowaki, M. / Comparison of dielectric properties of low-density polyethylene/MgO composites with different size fillers. Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP. 2008. pp. 208-211
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