Comparison of location abilities of degradation in a polymer-insulated cable between frequency domain reflectometry and line resonance analysis

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

The ability of locating a degraded portion in a double-core cable insulated with silicone rubber (SiR) or in a coaxial cable insulated with low-density polyethylene (LDPE) was compared between a system based on frequency domain reflectometry (FDR) being developed by the authors and a commercially available system called line resonance analysis (LIRA). Both the FDR and the LIRA methods cannot detect the degradation of SiR before its further use becomes uncommend-able in a nuclear power plant. However, for location trials of the degraded portion in the LDPE coaxial cable, the FDR method showed a higher sensitivity and a better resolution than LIRA.

Original languageEnglish
Title of host publicationICHVE 2016 - 2016 IEEE International Conference on High Voltage Engineering and Application
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781509004966
DOIs
Publication statusPublished - 2016 Dec 27
Event5th IEEE International Conference on High Voltage Engineering and Application, ICHVE 2016 - Chengdu, China
Duration: 2016 Sep 192016 Sep 22

Other

Other5th IEEE International Conference on High Voltage Engineering and Application, ICHVE 2016
CountryChina
CityChengdu
Period16/9/1916/9/22

Keywords

  • aging
  • cable
  • frequency domain reflectometry
  • low-density polyethylene
  • silicone rubber

ASJC Scopus subject areas

  • Energy Engineering and Power Technology
  • Electrical and Electronic Engineering

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  • Cite this

    Ohki, Y., & Hirai, N. (2016). Comparison of location abilities of degradation in a polymer-insulated cable between frequency domain reflectometry and line resonance analysis. In ICHVE 2016 - 2016 IEEE International Conference on High Voltage Engineering and Application [7800602] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICHVE.2016.7800602