Comparison of the effects of nanofiller materials on the dielectric properties of epoxy nanocomposites

J. Katayama, N. Fuse, M. Kozako, T. Tanaka, Yoshimichi Ohki

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    2 Citations (Scopus)

    Abstract

    Composites of organic polymers and well-dispersed nm-sized inorganic fillers, called polymer nanocomposites (NCs), have been attracting much attention as new electrical insulating materials. In this paper, experimental results on the typical dielectric properties, namely, complex permittivity ε( r and ε r"), conductivity, and thermally stimulated depolarization current (TSDC) are evaluated for bisphenol-A epoxy resin and its NCs with boehmite alumina, titania, and silica. The increase in ε r and ε r" and the magnitudes of the TSDC peaks as well as the increase in conductivity appear more significantly in the NCs with boehmite alumina and titania and less significantly in the NCs with silica than in epoxy resin. This indicates that the silica nanofillers give the best results as far as these properties are concerned. The suppression of molecular motion by the addition of nanofillers seems to work effectively in the case of silica, while the nanofiller addition is likely to accelerate the motion of ionic carriers and/or that of dipoles in the case of boehmite alumina and titania.

    Original languageEnglish
    Title of host publicationAnnual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP
    Pages318-321
    Number of pages4
    DOIs
    Publication statusPublished - 2011
    Event2011 Annual Report Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2011 - Cancun, Mexico
    Duration: 2011 Oct 162011 Oct 19

    Other

    Other2011 Annual Report Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2011
    CountryMexico
    CityCancun
    Period11/10/1611/10/19

    Fingerprint

    Silicon Dioxide
    Dielectric properties
    Aluminum Oxide
    Nanocomposites
    Silica
    Epoxy Resins
    Alumina
    Titanium
    Depolarization
    Epoxy resins
    Organic polymers
    Insulating materials
    Fillers
    Polymers
    Permittivity
    Composite materials
    titanium dioxide
    aluminum oxide hydroxide

    ASJC Scopus subject areas

    • Electronic, Optical and Magnetic Materials
    • Electrical and Electronic Engineering

    Cite this

    Katayama, J., Fuse, N., Kozako, M., Tanaka, T., & Ohki, Y. (2011). Comparison of the effects of nanofiller materials on the dielectric properties of epoxy nanocomposites. In Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP (pp. 318-321). [6232660] https://doi.org/10.1109/CEIDP.2011.6232660

    Comparison of the effects of nanofiller materials on the dielectric properties of epoxy nanocomposites. / Katayama, J.; Fuse, N.; Kozako, M.; Tanaka, T.; Ohki, Yoshimichi.

    Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP. 2011. p. 318-321 6232660.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Katayama, J, Fuse, N, Kozako, M, Tanaka, T & Ohki, Y 2011, Comparison of the effects of nanofiller materials on the dielectric properties of epoxy nanocomposites. in Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP., 6232660, pp. 318-321, 2011 Annual Report Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2011, Cancun, Mexico, 11/10/16. https://doi.org/10.1109/CEIDP.2011.6232660
    Katayama J, Fuse N, Kozako M, Tanaka T, Ohki Y. Comparison of the effects of nanofiller materials on the dielectric properties of epoxy nanocomposites. In Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP. 2011. p. 318-321. 6232660 https://doi.org/10.1109/CEIDP.2011.6232660
    Katayama, J. ; Fuse, N. ; Kozako, M. ; Tanaka, T. ; Ohki, Yoshimichi. / Comparison of the effects of nanofiller materials on the dielectric properties of epoxy nanocomposites. Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP. 2011. pp. 318-321
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