Compatibility of dielectric properties with other engineering performances

Toshikatsu Tanaka, Toshio Shimizu, Muneaki Kurimoto, Yoshimichi Ohki, Norio Kurokawa, Kenji Okamoto

    Research output: Chapter in Book/Report/Conference proceedingChapter

    Abstract

    Polymers naturally have low thermal conductivity. Polymer composites with practical high dielectric strength are required to have relatively high thermal conductivity. When polymers are loaded with high thermally conductive inorganic micro-fillers, 88resulting composites have high thermal conductivity due to percolation effect of micro-fillers. However, they often suffer from reduced dielectric breakdown strength. In order to overcome this reduction, a certain nanotechnology method has been explored using nanofillers.

    Original languageEnglish
    Title of host publicationAdvanced Nanodielectrics
    Subtitle of host publicationFundamentals and Applications
    PublisherPan Stanford Publishing Pte. Ltd.
    Number of pages1
    ISBN (Electronic)9781351862981
    ISBN (Print)9789814745024
    DOIs
    Publication statusPublished - 2017 Jan 1

    Fingerprint

    Dielectric properties
    Thermal conductivity
    Polymers
    Fillers
    Composite materials
    Electric breakdown
    Nanotechnology

    ASJC Scopus subject areas

    • Engineering(all)
    • Materials Science(all)

    Cite this

    Tanaka, T., Shimizu, T., Kurimoto, M., Ohki, Y., Kurokawa, N., & Okamoto, K. (2017). Compatibility of dielectric properties with other engineering performances. In Advanced Nanodielectrics: Fundamentals and Applications Pan Stanford Publishing Pte. Ltd.. https://doi.org/10.1201/9781315230740

    Compatibility of dielectric properties with other engineering performances. / Tanaka, Toshikatsu; Shimizu, Toshio; Kurimoto, Muneaki; Ohki, Yoshimichi; Kurokawa, Norio; Okamoto, Kenji.

    Advanced Nanodielectrics: Fundamentals and Applications. Pan Stanford Publishing Pte. Ltd., 2017.

    Research output: Chapter in Book/Report/Conference proceedingChapter

    Tanaka, T, Shimizu, T, Kurimoto, M, Ohki, Y, Kurokawa, N & Okamoto, K 2017, Compatibility of dielectric properties with other engineering performances. in Advanced Nanodielectrics: Fundamentals and Applications. Pan Stanford Publishing Pte. Ltd. https://doi.org/10.1201/9781315230740
    Tanaka T, Shimizu T, Kurimoto M, Ohki Y, Kurokawa N, Okamoto K. Compatibility of dielectric properties with other engineering performances. In Advanced Nanodielectrics: Fundamentals and Applications. Pan Stanford Publishing Pte. Ltd. 2017 https://doi.org/10.1201/9781315230740
    Tanaka, Toshikatsu ; Shimizu, Toshio ; Kurimoto, Muneaki ; Ohki, Yoshimichi ; Kurokawa, Norio ; Okamoto, Kenji. / Compatibility of dielectric properties with other engineering performances. Advanced Nanodielectrics: Fundamentals and Applications. Pan Stanford Publishing Pte. Ltd., 2017.
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