Compatibility of dielectric properties with other engineering performances

Toshikatsu Tanaka, Toshio Shimizu, Muneaki Kurimoto, Yoshimichi Ohki, Norio Kurokawa, Kenji Okamoto

Research output: Chapter in Book/Report/Conference proceedingChapter

Abstract

Polymers naturally have low thermal conductivity. Polymer composites with practical high dielectric strength are required to have relatively high thermal conductivity. When polymers are loaded with high thermally conductive inorganic micro-fillers, 88resulting composites have high thermal conductivity due to percolation effect of micro-fillers. However, they often suffer from reduced dielectric breakdown strength. In order to overcome this reduction, a certain nanotechnology method has been explored using nanofillers.

Original languageEnglish
Title of host publicationAdvanced Nanodielectrics
Subtitle of host publicationFundamentals and Applications
PublisherPan Stanford Publishing Pte. Ltd.
Number of pages1
ISBN (Electronic)9781351862981
ISBN (Print)9789814745024
DOIs
Publication statusPublished - 2017 Jan 1

ASJC Scopus subject areas

  • Engineering(all)
  • Materials Science(all)

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  • Cite this

    Tanaka, T., Shimizu, T., Kurimoto, M., Ohki, Y., Kurokawa, N., & Okamoto, K. (2017). Compatibility of dielectric properties with other engineering performances. In Advanced Nanodielectrics: Fundamentals and Applications Pan Stanford Publishing Pte. Ltd.. https://doi.org/10.1201/9781315230740