Compatibility of dielectric properties with other engineering performances

Toshikatsu Tanaka; Toshio Shimizu; Muneaki Kurimoto; Yoshimichi Ohki; Norio Kurokawa; Kenji Okamoto

doi:10.1201/9781315230740

Compatibility of dielectric properties with other engineering performances

Toshikatsu Tanaka, Toshio Shimizu, Muneaki Kurimoto, Yoshimichi Ohki, Norio Kurokawa, Kenji Okamoto

School of Advanced Science and Engineering

Research output: Chapter in Book/Report/Conference proceeding › Chapter

Abstract

Polymers naturally have low thermal conductivity. Polymer composites with practical high dielectric strength are required to have relatively high thermal conductivity. When polymers are loaded with high thermally conductive inorganic micro-fillers, 88resulting composites have high thermal conductivity due to percolation effect of micro-fillers. However, they often suffer from reduced dielectric breakdown strength. In order to overcome this reduction, a certain nanotechnology method has been explored using nanofillers.

Original language	English
Title of host publication	Advanced Nanodielectrics
Subtitle of host publication	Fundamentals and Applications
Publisher	Pan Stanford Publishing Pte. Ltd.
Number of pages	1
ISBN (Electronic)	9781351862981
ISBN (Print)	9789814745024
DOIs	https://doi.org/10.1201/9781315230740
Publication status	Published - 2017 Jan 1

ASJC Scopus subject areas

Engineering(all)
Materials Science(all)

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10.1201/9781315230740

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AU - Kurokawa, Norio

AU - Okamoto, Kenji

PY - 2017/1/1

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AB - Polymers naturally have low thermal conductivity. Polymer composites with practical high dielectric strength are required to have relatively high thermal conductivity. When polymers are loaded with high thermally conductive inorganic micro-fillers, 88resulting composites have high thermal conductivity due to percolation effect of micro-fillers. However, they often suffer from reduced dielectric breakdown strength. In order to overcome this reduction, a certain nanotechnology method has been explored using nanofillers.

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Compatibility of dielectric properties with other engineering performances

Abstract

ASJC Scopus subject areas

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