Abstract
In this paper, fabrication methods of metal patterns using ultraviolet nanoimprint lithography (UV-NIL) and electrodeposition are demonstrated. Since the photocurable resin patterned by UV-NIL was directly used for electrodeposition mask, the simple and high-throughput fabrication process was realized. Several examples of functional device using these methods are described.
| Original language | English |
|---|---|
| Pages (from-to) | 343-346 |
| Number of pages | 4 |
| Journal | IEEJ Transactions on Sensors and Micromachines |
| Volume | 130 |
| Issue number | 8 |
| DOIs | |
| Publication status | Published - 2010 |
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Keywords
- Electrodeposition
- UV-NIL
- UV-photocurable resin
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Mechanical Engineering
Cite this
Compound nanoimprint processes and their applications for devices. / Mizuno, Jun; Shinohara, Hidetoshi.
In: IEEJ Transactions on Sensors and Micromachines, Vol. 130, No. 8, 2010, p. 343-346.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Compound nanoimprint processes and their applications for devices
AU - Mizuno, Jun
AU - Shinohara, Hidetoshi
PY - 2010
Y1 - 2010
N2 - In this paper, fabrication methods of metal patterns using ultraviolet nanoimprint lithography (UV-NIL) and electrodeposition are demonstrated. Since the photocurable resin patterned by UV-NIL was directly used for electrodeposition mask, the simple and high-throughput fabrication process was realized. Several examples of functional device using these methods are described.
AB - In this paper, fabrication methods of metal patterns using ultraviolet nanoimprint lithography (UV-NIL) and electrodeposition are demonstrated. Since the photocurable resin patterned by UV-NIL was directly used for electrodeposition mask, the simple and high-throughput fabrication process was realized. Several examples of functional device using these methods are described.
KW - Electrodeposition
KW - UV-NIL
KW - UV-photocurable resin
UR - http://www.scopus.com/inward/record.url?scp=77956971696&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=77956971696&partnerID=8YFLogxK
U2 - 10.1541/ieejsmas.130.343
DO - 10.1541/ieejsmas.130.343
M3 - Article
AN - SCOPUS:77956971696
VL - 130
SP - 343
EP - 346
JO - IEEJ Transactions on Sensors and Micromachines
JF - IEEJ Transactions on Sensors and Micromachines
SN - 1341-8939
IS - 8
ER -