TY - JOUR
T1 - Conjugated polymer network ultrathin films on metal interfaces using the precursor polymer approach
T2 - Design, synthesis and in-situ characterization
AU - Advincula, Rigoberto
AU - Xia, Chuanjun
AU - Taranekar, Prasad
AU - Onishi, Ken
AU - Deng, Suxiang
AU - Baba, Akira
AU - Knoll, Wolfgang
PY - 2003
Y1 - 2003
N2 - We have reported recently a novel method for cross-linking conjugated polymers involving a "precursor polymer" route, where the electrochemical method can be used to prepare ultrathin films on conducting metal and metal oxide surfaces. In this paper, we present the design, synthesis, protocol, and recent results in the application of these thin film materials. An emphasis will he given on how these films are characterized in-situ by a combined surface plasmon spectroscopy (SPS) and electrochemical approach. As a methodology, the concept can be extended to new methods of electrodeposition, patterning, and grafting of conjugated polymers on electrochemically addressable metal surfaces. Compared to spin-cast or electropolymerized monomer films, they are very robust both thermally and mechanically. Other applications of these films to sensors, dielectric materials, non-lithographic patterning, etc. are currently being investigated.
AB - We have reported recently a novel method for cross-linking conjugated polymers involving a "precursor polymer" route, where the electrochemical method can be used to prepare ultrathin films on conducting metal and metal oxide surfaces. In this paper, we present the design, synthesis, protocol, and recent results in the application of these thin film materials. An emphasis will he given on how these films are characterized in-situ by a combined surface plasmon spectroscopy (SPS) and electrochemical approach. As a methodology, the concept can be extended to new methods of electrodeposition, patterning, and grafting of conjugated polymers on electrochemically addressable metal surfaces. Compared to spin-cast or electropolymerized monomer films, they are very robust both thermally and mechanically. Other applications of these films to sensors, dielectric materials, non-lithographic patterning, etc. are currently being investigated.
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M3 - Article
AN - SCOPUS:0038649985
SN - 0272-9172
VL - 734
SP - 21
EP - 26
JO - Materials Research Society Symposium - Proceedings
JF - Materials Research Society Symposium - Proceedings
ER -