Convex-cost flow based redundant-via insertion with density-balance consideration

Wei Guo*, Song Chen, Mei Fang Chiang, Jian Wei Shen, Takeshi Yoshimura

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)


As VLSI design complexity continues to increase, the yield loss due to via failure becomes more and more significant. Redundant via insertion is highly recommended for improving chip yield and reliability. In this paper, we study the redundant via insertion problem in a post-routing stage, where a single via can have at most one redundant via inserted next to it .The goal is to insert as many redundant vias as possible and, at the same time, try to equilibrate the via density, which is good for the via density rules. We propose a convex-cost flow based approach to solve the problem within up to three routing layers. The experimental results show that, the proposed method can produce optimal solutions on defined density grid structure with maximum redundant via insertion, and achieve an at least 32.61% improvement of via density equalization.

Original languageEnglish
Title of host publicationASICON 2009 - Proceedings 2009 8th IEEE International Conference on ASIC
Number of pages4
Publication statusPublished - 2009
Event2009 8th IEEE International Conference on ASIC, ASICON 2009 - Changsha
Duration: 2009 Oct 202009 Oct 23


Other2009 8th IEEE International Conference on ASIC, ASICON 2009


  • Density-balance
  • DFM
  • Redundant via insertion
  • Via density

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering


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