Coping with disassembly yield uncertainty in remanufacturing using sensor embedded products

Mehmet Ali Ilgin, Surendra M. Gupta, Kenichi Nakashima

Research output: Contribution to journalArticle

12 Citations (Scopus)

Abstract

This paper proposes and investigates the use of embedding sensors in products when designing and manufacturing them to improve the efficiency during their end-of-life (EOL) processing. First, separate design of experiments studies based on orthogonal arrays are carried out for conventional products (CPs) and sensor embedded products (SEPs). In order to calculate the response values for each experiment, detailed discrete event simulation models of both cases are developed considering the precedence relationships among the components together with the routing of different appliance types through the disassembly line. Then, pair-wise t-tests are conducted to compare the two cases based on different performance measures. The results showed that sensor embedded products improve revenue and profit while achieving significant reductions in backorder, disassembly, disposal, holding, testing and transportation costs. While the paper addresses the EOL processing of dish washers and dryers, the approach provided could be extended to any other industrial product.

Original languageEnglish
Article number7
JournalJournal of Remanufacturing
Volume1
Issue number1
DOIs
Publication statusPublished - 2011 Dec 1
Externally publishedYes

Fingerprint

sensor
Sensors
Washers
Discrete event simulation
Processing
Design of experiments
Profitability
routing
manufacturing
experiment
Testing
Uncertainty
product
Costs
Experiments
cost
simulation
test
industrial product
profit

Keywords

  • cost-benefit analysis
  • disassembly line
  • discrete event simulation
  • experimental design
  • sensor embedded products

ASJC Scopus subject areas

  • Waste Management and Disposal
  • Industrial and Manufacturing Engineering
  • Management, Monitoring, Policy and Law

Cite this

Coping with disassembly yield uncertainty in remanufacturing using sensor embedded products. / Ilgin, Mehmet Ali; Gupta, Surendra M.; Nakashima, Kenichi.

In: Journal of Remanufacturing, Vol. 1, No. 1, 7, 01.12.2011.

Research output: Contribution to journalArticle

Ilgin, Mehmet Ali ; Gupta, Surendra M. ; Nakashima, Kenichi. / Coping with disassembly yield uncertainty in remanufacturing using sensor embedded products. In: Journal of Remanufacturing. 2011 ; Vol. 1, No. 1.
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