Copper multilayer interconnection using ultravaiolet nanoimprint lithography with a double-deck mold and electroplating

Noriyasu Nagai, Hiroshi Ono, Katsuyuki Sakuma, Mikiko Saito, Jun Mizuno, Shuichi Shoji

Research output: Contribution to journalArticle

6 Citations (Scopus)

Abstract

An approach to realizing a two-step interconnection using a double-deck quartz mold based on ultraviolet nanoimprint lithography (UV-NIL) technology and Cu electroplating is discussed. The double-deck mold realizes a two-step simultaneous transcription and a two-step nanoscale interconnection. Nanoscale via and trench array patterns of Cu were formed on a silicon substrate using UV-NIL in combination with electroplating. Imprinted via and trench patterns were simultaneously formed on a photocurable resin by the double-deck mold with a two-step structure. Using this mold, 73nm metal via and 190nm metal trench patterns were successfully fabricated by electroplating.

Original languageEnglish
Article number115001
JournalJapanese journal of applied physics
Volume48
Issue number11
DOIs
Publication statusPublished - 2009 Dec 1

    Fingerprint

ASJC Scopus subject areas

  • Engineering(all)
  • Physics and Astronomy(all)

Cite this