Copper/parylene core/shell nanowire surface fastener used for room-temperature electrical bonding

Peng Wang, Yang Ju, Yanbin Cui, Atsushi Hosoi

Research output: Contribution to journalArticle

8 Citations (Scopus)

Abstract

The traditional bonding technology in electronic assembly relies on high-temperature processes, such as reflow soldering or curing of adhesives, which result in undesired thermal excursions and residual stress at the bonding interface. Therefore, there is an urgent need to attach electronic components on the circuit board with good mechanical and electrical properties at room temperature. In this paper, a room-temperature electrical surface fastener consisting of copper/parylene core/shell nanowire (NW) arrays were prepared, and van der Waals (VDW) forces were utilized to interconnect the core/shell NWs. Interestingly, the Parylene C film becomes conductive due to dielectric breakdown when the thickness of it is miniaturized to nanoscale. Our electrical surface fastener exhibits high macroscopic adhesion strength (∼25 N/cm 2) and low electrical resistance (∼4.22 × 10-2 Ω·cm2). Meanwhile, a new theoretical model based on VDW forces between the NWs is proposed to explain the adhesion mechanism of the core/shell structure.

Original languageEnglish
Pages (from-to)13909-13916
Number of pages8
JournalLangmuir
Volume29
Issue number45
DOIs
Publication statusPublished - 2013 Nov 12
Externally publishedYes

Fingerprint

fasteners
Fasteners
Nanowires
Copper
Van der Waals forces
nanowires
copper
adhesion
room temperature
Conductive films
soldering
Acoustic impedance
Bond strength (materials)
Soldering
circuit boards
curing
electrical resistance
Electric breakdown
electronics
Thermal stress

ASJC Scopus subject areas

  • Electrochemistry
  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Materials Science(all)
  • Spectroscopy

Cite this

Copper/parylene core/shell nanowire surface fastener used for room-temperature electrical bonding. / Wang, Peng; Ju, Yang; Cui, Yanbin; Hosoi, Atsushi.

In: Langmuir, Vol. 29, No. 45, 12.11.2013, p. 13909-13916.

Research output: Contribution to journalArticle

Wang, Peng ; Ju, Yang ; Cui, Yanbin ; Hosoi, Atsushi. / Copper/parylene core/shell nanowire surface fastener used for room-temperature electrical bonding. In: Langmuir. 2013 ; Vol. 29, No. 45. pp. 13909-13916.
@article{4017210642534e38bcf712d5c63c7bf9,
title = "Copper/parylene core/shell nanowire surface fastener used for room-temperature electrical bonding",
abstract = "The traditional bonding technology in electronic assembly relies on high-temperature processes, such as reflow soldering or curing of adhesives, which result in undesired thermal excursions and residual stress at the bonding interface. Therefore, there is an urgent need to attach electronic components on the circuit board with good mechanical and electrical properties at room temperature. In this paper, a room-temperature electrical surface fastener consisting of copper/parylene core/shell nanowire (NW) arrays were prepared, and van der Waals (VDW) forces were utilized to interconnect the core/shell NWs. Interestingly, the Parylene C film becomes conductive due to dielectric breakdown when the thickness of it is miniaturized to nanoscale. Our electrical surface fastener exhibits high macroscopic adhesion strength (∼25 N/cm 2) and low electrical resistance (∼4.22 × 10-2 Ω·cm2). Meanwhile, a new theoretical model based on VDW forces between the NWs is proposed to explain the adhesion mechanism of the core/shell structure.",
author = "Peng Wang and Yang Ju and Yanbin Cui and Atsushi Hosoi",
year = "2013",
month = "11",
day = "12",
doi = "10.1021/la402475f",
language = "English",
volume = "29",
pages = "13909--13916",
journal = "Langmuir",
issn = "0743-7463",
publisher = "American Chemical Society",
number = "45",

}

TY - JOUR

T1 - Copper/parylene core/shell nanowire surface fastener used for room-temperature electrical bonding

AU - Wang, Peng

AU - Ju, Yang

AU - Cui, Yanbin

AU - Hosoi, Atsushi

PY - 2013/11/12

Y1 - 2013/11/12

N2 - The traditional bonding technology in electronic assembly relies on high-temperature processes, such as reflow soldering or curing of adhesives, which result in undesired thermal excursions and residual stress at the bonding interface. Therefore, there is an urgent need to attach electronic components on the circuit board with good mechanical and electrical properties at room temperature. In this paper, a room-temperature electrical surface fastener consisting of copper/parylene core/shell nanowire (NW) arrays were prepared, and van der Waals (VDW) forces were utilized to interconnect the core/shell NWs. Interestingly, the Parylene C film becomes conductive due to dielectric breakdown when the thickness of it is miniaturized to nanoscale. Our electrical surface fastener exhibits high macroscopic adhesion strength (∼25 N/cm 2) and low electrical resistance (∼4.22 × 10-2 Ω·cm2). Meanwhile, a new theoretical model based on VDW forces between the NWs is proposed to explain the adhesion mechanism of the core/shell structure.

AB - The traditional bonding technology in electronic assembly relies on high-temperature processes, such as reflow soldering or curing of adhesives, which result in undesired thermal excursions and residual stress at the bonding interface. Therefore, there is an urgent need to attach electronic components on the circuit board with good mechanical and electrical properties at room temperature. In this paper, a room-temperature electrical surface fastener consisting of copper/parylene core/shell nanowire (NW) arrays were prepared, and van der Waals (VDW) forces were utilized to interconnect the core/shell NWs. Interestingly, the Parylene C film becomes conductive due to dielectric breakdown when the thickness of it is miniaturized to nanoscale. Our electrical surface fastener exhibits high macroscopic adhesion strength (∼25 N/cm 2) and low electrical resistance (∼4.22 × 10-2 Ω·cm2). Meanwhile, a new theoretical model based on VDW forces between the NWs is proposed to explain the adhesion mechanism of the core/shell structure.

UR - http://www.scopus.com/inward/record.url?scp=84887580061&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84887580061&partnerID=8YFLogxK

U2 - 10.1021/la402475f

DO - 10.1021/la402475f

M3 - Article

C2 - 24116694

AN - SCOPUS:84887580061

VL - 29

SP - 13909

EP - 13916

JO - Langmuir

JF - Langmuir

SN - 0743-7463

IS - 45

ER -