Core-shell nanowire based electrical surface fastener used for room-temperature electronic packaging bonding

Peng Wang, Yang Ju, Atsushi Hosoi

Research output: Contribution to journalArticle

6 Citations (Scopus)

Abstract

With the ongoing miniaturization in electronic packaging, the traditional solders suffer from severe performance degradation. In addition, the high temperature required in the traditional solder reflow process may damage electronic elements. Therefore, there is an increasing urgent need for a new kind of nontoxic solder that can afford good mechanical stress and electrical contact at low temperature. This paper presents a method of fabricating nanowire surface fastener for the application of microelectronic packaging bonding at room temperature. This surface fastener consists of copper core and polystyrene shell nanowire arrays. It showed an adhesive strength of ~;24 N/cm2 and an electrical resistance of ~;0.41 × 10-2 Ω·cm2. This kind of nanowire surface fastener may enable the exploration of wide range applications, involving assembly of components in the electronic packaging.

Original languageEnglish
Pages (from-to)503-507
Number of pages5
JournalElectronic Materials Letters
Volume10
Issue number2
DOIs
Publication statusPublished - 2014 Mar
Externally publishedYes

Keywords

  • electronic packaging
  • nanowire
  • solder bump
  • surface fastener

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

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