Abstract
With the ongoing miniaturization in electronic packaging, the traditional solders suffer from severe performance degradation. In addition, the high temperature required in the traditional solder reflow process may damage electronic elements. Therefore, there is an increasing urgent need for a new kind of nontoxic solder that can afford good mechanical stress and electrical contact at low temperature. This paper presents a method of fabricating nanowire surface fastener for the application of microelectronic packaging bonding at room temperature. This surface fastener consists of copper core and polystyrene shell nanowire arrays. It showed an adhesive strength of ~;24 N/cm2 and an electrical resistance of ~;0.41 × 10-2 Ω·cm2. This kind of nanowire surface fastener may enable the exploration of wide range applications, involving assembly of components in the electronic packaging.
| Original language | English |
|---|---|
| Pages (from-to) | 503-507 |
| Number of pages | 5 |
| Journal | Electronic Materials Letters |
| Volume | 10 |
| Issue number | 2 |
| DOIs | |
| Publication status | Published - 2014 |
| Externally published | Yes |
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Keywords
- electronic packaging
- nanowire
- solder bump
- surface fastener
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
Cite this
Core-shell nanowire based electrical surface fastener used for room-temperature electronic packaging bonding. / Wang, Peng; Ju, Yang; Hosoi, Atsushi.
In: Electronic Materials Letters, Vol. 10, No. 2, 2014, p. 503-507.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Core-shell nanowire based electrical surface fastener used for room-temperature electronic packaging bonding
AU - Wang, Peng
AU - Ju, Yang
AU - Hosoi, Atsushi
PY - 2014
Y1 - 2014
N2 - With the ongoing miniaturization in electronic packaging, the traditional solders suffer from severe performance degradation. In addition, the high temperature required in the traditional solder reflow process may damage electronic elements. Therefore, there is an increasing urgent need for a new kind of nontoxic solder that can afford good mechanical stress and electrical contact at low temperature. This paper presents a method of fabricating nanowire surface fastener for the application of microelectronic packaging bonding at room temperature. This surface fastener consists of copper core and polystyrene shell nanowire arrays. It showed an adhesive strength of ~;24 N/cm2 and an electrical resistance of ~;0.41 × 10-2 Ω·cm2. This kind of nanowire surface fastener may enable the exploration of wide range applications, involving assembly of components in the electronic packaging.
AB - With the ongoing miniaturization in electronic packaging, the traditional solders suffer from severe performance degradation. In addition, the high temperature required in the traditional solder reflow process may damage electronic elements. Therefore, there is an increasing urgent need for a new kind of nontoxic solder that can afford good mechanical stress and electrical contact at low temperature. This paper presents a method of fabricating nanowire surface fastener for the application of microelectronic packaging bonding at room temperature. This surface fastener consists of copper core and polystyrene shell nanowire arrays. It showed an adhesive strength of ~;24 N/cm2 and an electrical resistance of ~;0.41 × 10-2 Ω·cm2. This kind of nanowire surface fastener may enable the exploration of wide range applications, involving assembly of components in the electronic packaging.
KW - electronic packaging
KW - nanowire
KW - solder bump
KW - surface fastener
UR - http://www.scopus.com/inward/record.url?scp=84896498803&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84896498803&partnerID=8YFLogxK
U2 - 10.1007/s13391-014-8005-7
DO - 10.1007/s13391-014-8005-7
M3 - Article
AN - SCOPUS:84896498803
VL - 10
SP - 503
EP - 507
JO - Electronic Materials Letters
JF - Electronic Materials Letters
SN - 1738-8090
IS - 2
ER -